
The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated circuits smaller, and packing more of them together, to achieve more powerful and efficient chips. However, all power that goes into these billions of transistors is turned into heat. This heat needs to be extracted, as overheating causes chips to fail and lose performance. With transistors approaching the size of a few atoms, extracting this highly concentrated heat is rapidly becoming a bottleneck for the next generations of computing. In addition, cooling of chips accounts for about 30% of electricity consumption in data centers, causing an enormous environmental footprint. Sustainable and high-performance heat extraction is key to satisfy our ever-increasing demand for computational power. We are a provider of breakthrough semiconductor cooling solutions. Our solution utilizes a network of microscopically small cooling channels embedded inside the chip, which enables us to extract 10 times more heat compared to the current leading market alternatives, and extract this heat over 50x more energy efficiently. This enables the powerful integrated circuits of the future to break thermal limitations in a sustainable manner.

The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated circuits smaller, and packing more of them together, to achieve more powerful and efficient chips. However, all power that goes into these billions of transistors is turned into heat. This heat needs to be extracted, as overheating causes chips to fail and lose performance. With transistors approaching the size of a few atoms, extracting this highly concentrated heat is rapidly becoming a bottleneck for the next generations of computing. In addition, cooling of chips accounts for about 30% of electricity consumption in data centers, causing an enormous environmental footprint. Sustainable and high-performance heat extraction is key to satisfy our ever-increasing demand for computational power. We are a provider of breakthrough semiconductor cooling solutions. Our solution utilizes a network of microscopically small cooling channels embedded inside the chip, which enables us to extract 10 times more heat compared to the current leading market alternatives, and extract this heat over 50x more energy efficiently. This enables the powerful integrated circuits of the future to break thermal limitations in a sustainable manner.
What they do: Silicon microfluidic cooling: microscopic liquid-cooling channels embedded for high-power chips (data center / HPC / AI).
Founded / HQ: Founded 2022 — Lausanne, Switzerland (EPFL Innovation Park).
Technology advantage: Embedded micro-channel / microfluidic approach claimed to extract ~10x more heat and be ~50x more energy efficient vs leading alternatives.
Latest funding: $25.0M Series A1 (2025) — company & Dealroom cite Applied Digital as lead; other listings identify BlueYard Capital.
Applied Digital, BlueYard Capital, XTX Ventures, Founderful, Lip-Bu Tan, Celsius Industries, Acequia Capital.
| Company |
|---|
Thermal management for high-power compute (data centers, AI accelerators, HPC).
2022
Computers and Electronics Manufacturing
Seed round (announced Jan 21, 2022); participating angels and investors reported in investor listings.
$25.0M
Company and Dealroom list a $25M Series A1 led by Applied Digital; other investor listings identify BlueYard Capital as a lead for the Series A.
“Reported investors include Applied Digital, BlueYard Capital, XTX Ventures, Founderful, Lip-Bu Tan, Celsius Industries, Acequia Capital; non-dilutive support items reported include Intel Ignite, Venture Kick, and Prix Strategis.”
Vice President of Simulation Software
About Corintis
Corintis is a startup that is a provider of advanced semiconductor cooling technologies. Some of the biggest challenges of our lifetime, from climate modeling to drug discovery, constantly require more computing power. More powerful chips generate more heat; extracting this heat is a major challenge for our future.
Current cooling systems are not only limited but also wasteful; cooling data centers consume more power than London and New York combined. At Corintis, we remove these limitations by integrating cooling directly inside the chip. We enable the sustainable computing of the future to address the biggest global challenges.
Working at Corintis
Corintis offers a friendly and team-oriented workplace bringing together a diverse group of nationalities to solve the biggest computing challenges of tomorrow. Based on the EPFL campus near Lausanne, we are closely connected to the local ecosystem and are located a few minutes walk from Lake Geneva.
Job Description
We are seeking a highly autonomous Vice President of Simulation Software to lead the vision, strategy, and execution of Corintis’ thermal simulation and optimization software portfolio. Reporting directly to the CEO, this role shapes the long-term direction of our simulation products, ensuring they remain best-in-class for modeling multiphysics behavior in next-generation semiconductor cooling systems.
The VP of Simulation Software owns the product vision of “Cooling Design Automation”, drives strategic customer partnerships, ensures world-class execution, and leads the engineering organization through our next phase of growth.
Responsibilities
Requirements
This role is a great fit for you if:
This won’t be the right role for you if: