
The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated circuits smaller, and packing more of them together, to achieve more powerful and efficient chips. However, all power that goes into these billions of transistors is turned into heat. This heat needs to be extracted, as overheating causes chips to fail and lose performance. With transistors approaching the size of a few atoms, extracting this highly concentrated heat is rapidly becoming a bottleneck for the next generations of computing. In addition, cooling of chips accounts for about 30% of electricity consumption in data centers, causing an enormous environmental footprint. Sustainable and high-performance heat extraction is key to satisfy our ever-increasing demand for computational power. We are a provider of breakthrough semiconductor cooling solutions. Our solution utilizes a network of microscopically small cooling channels embedded inside the chip, which enables us to extract 10 times more heat compared to the current leading market alternatives, and extract this heat over 50x more energy efficiently. This enables the powerful integrated circuits of the future to break thermal limitations in a sustainable manner.

The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated circuits smaller, and packing more of them together, to achieve more powerful and efficient chips. However, all power that goes into these billions of transistors is turned into heat. This heat needs to be extracted, as overheating causes chips to fail and lose performance. With transistors approaching the size of a few atoms, extracting this highly concentrated heat is rapidly becoming a bottleneck for the next generations of computing. In addition, cooling of chips accounts for about 30% of electricity consumption in data centers, causing an enormous environmental footprint. Sustainable and high-performance heat extraction is key to satisfy our ever-increasing demand for computational power. We are a provider of breakthrough semiconductor cooling solutions. Our solution utilizes a network of microscopically small cooling channels embedded inside the chip, which enables us to extract 10 times more heat compared to the current leading market alternatives, and extract this heat over 50x more energy efficiently. This enables the powerful integrated circuits of the future to break thermal limitations in a sustainable manner.
What they do: Silicon microfluidic cooling: microscopic liquid-cooling channels embedded for high-power chips (data center / HPC / AI).
Founded / HQ: Founded 2022 — Lausanne, Switzerland (EPFL Innovation Park).
Technology advantage: Embedded micro-channel / microfluidic approach claimed to extract ~10x more heat and be ~50x more energy efficient vs leading alternatives.
Latest funding: $25.0M Series A1 (2025) — company & Dealroom cite Applied Digital as lead; other listings identify BlueYard Capital.
Notable investors: Applied Digital, BlueYard Capital, XTX Ventures, Founderful, Lip-Bu Tan, Celsius Industries, Acequia Capital.
Thermal management for high-power compute (data centers, AI accelerators, HPC).
2022
Computers and Electronics Manufacturing
Seed round (announced Jan 21, 2022); participating angels and investors reported in investor listings.
$25.0M
Company and Dealroom list a $25M Series A1 led by Applied Digital; other investor listings identify BlueYard Capital as a lead for the Series A.
“Reported investors include Applied Digital, BlueYard Capital, XTX Ventures, Founderful, Lip-Bu Tan, Celsius Industries, Acequia Capital; non-dilutive support items reported include Intel Ignite, Venture Kick, and Prix Strategis.”
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We are seeking a Thermo-Mechanical Modeling Engineer with a focus on modeling and designing high performance thermal test vehicle TTV in HVM for various customer shows the achievement of Corintis over the last year. Supported by investment companies with 24M$ capital enables Corintis to continue the successful way and become the world class liquid colling provider for high power chips in data centers Strengthen our thermo-mechanical team with your experience. Setting up models of whole modules with packages on PCB and adapted cooling solution to analyse the thermo-mechanical stresses and propose measurements of improvements. Your main working projects are within Corintis Therminator & Thermal Test Vehicle (TTV) , but also cold plates and in chip cooling designs. Your simulation results are the basis of design decisions and product structures. Your simulation expertise supports also our reliability experts to predict and set the right life time estimations of our products.
We are seeking a candidate based in Munich who is willing to travel frequently to our headquarter in Switzerland, including spending the first three months onsite in Lausanne for comprehensive onboarding with the team.
Responsibilities:
Requirements:
This is a great fit if you:
This won’t be the right role for you if: