About Us We are building Physics AI for hardware design. Our product helps engineers explore, analyze, and optimize hardware systems, integrating cutting-edge AI with the realities of engineering design workflows.

Role Overview As part of the Forward Deployment Sales team , you will play a key role in accelerating the adoption of Vinci’s software with leading engineering teams. You will work closely with prospective customers to demonstrate Vinci’s capabilities and show how the platform can significantly improve product design, thermal performance, time to market and reliability.

In this role, you will build and simulate t hermo-mechanical models based on customer designs to validate Vinci’s software and demonstrate its value in real-world engineering applications. You will apply your expertise in mechanical and thermo-mechanical analysis to evaluate warpage, stress behavior, and reliability in electronics packages, chips, and wafer-scale devices.

You will leverage a strong foundation in continuum mechanics to analyze complex physical phenomena, including linear and nonlinear behavior, geometric and material nonlinearities, and contact interactions, enabling accurate modeling of advanced semiconductor and electronics systems.

You will collaborate directly with customer engineering teams to understand their requirements, answer technical questions, and clearly communicate Vinci’s product capabilities. Your insights from customer engagements will also help guide product development by identifying key needs and opportunities for improvement.

This is a hybrid role, with the expectation of working 3 days per week in our Palo Alto office for close collaboration with Sales, Product, and Engineering. The role includes moderate travel, primarily within the United States. Some infrequent international travel may be required for key customers and events in Asia and Europe.

Responsibilities

• Engage with customer engineering teams during the evaluation phase by supporting simulation setup, running test cases, and interpreting results to demonstrate Vinci’s value.
• Collaborate with the sales team to deliver product demonstrations, conduct proof-of-concept evaluations, and participate in in-depth technical discussions with prospective customers.
• Support customer onboarding and deployments by providing technical guidance, training, and troubleshooting throughout the deployment and production phases.
• Identify customer pain points and workflow challenges, and collaborate with the product and engineering teams to improve product capabilities and overall customer experience.

Required Qualifications

• Degree in Mechanical, Electrical, or related engineering field
• 3+ years of hands-on mechanical analysis for warpage, stress and reliability using commercial softwares such as Ansys, Abaqus, LS dyna, etc.
• Experience in Customer-facing roles
• Strong problem-solving mindset and ability to quickly learn new tools and workflows
• Strong ability to communicate complex results clearly to a mixed audience (technical + business)

Preferred Qualifications

• Familiarity with semiconductor electronics packaging, advanced packaging or foundry (chip warpage, wafer warpage, 2.5D/3D IC, etc.)
• Experience in pre-sales, technical sales, or customer-facing engineering roles
• Ability to rapidly learn and adapt to new physics-based workflows and AI-assisted design tools
• Experience with commercializing technical software—ideally EDA or simulation tools—into semiconductor and electronics companies

Why Join Us

• Be part of a team defining the future of AI in hardware design.
• Work at the intersection of advanced AI, real-world engineering, and customer success.
• Collaborate with world-class engineers and researchers in a fast-moving startup environment.

Compensation Range: $140K - $200K