Xscape Photonics is a cutting-edge technology company developing advanced photonic
systems for high-performance computing and communication applications. Our work
focuses on enabling next-generation optical interconnects through innovative integration
of photonics, electronics, and packaging technologies. We are building highly efficient,
scalable solutions where thermal management plays a critical role in performance,
reliability, and product success.
We are seeking a motivated Thermal Engineer with 1–3 years of experience to support
the design, simulation, and testing of thermal solutions for photonic and electronic
systems. This role involves developing cooling strategies for sensitive optical and
electronic components using technologies such as thermoelectric coolers (TECs),
thermal interface materials (TIMs), heat spreaders, vapor chamber along with air and
liquid cooling systems.
You will work closely with cross-functional teams including optical, mechanical,
electrical, packaging, firmware, control and reliability engineers to ensure robust thermal
performance across a range of operating conditions.
Key Responsibilities
- Design and analyze thermal management solutions for photonic devices and systems.
- Develop cooling strategies using: Thermoelectric coolers (TECs), Thermal interface materials (TIMs), Heat spreaders and heat sinks, Air cooling and liquid cooling approaches.
- Perform thermal simulations to predict temperature distribution, heat flow, and thermal crosstalk.
- Conduct thermal and fluid experiments to validate designs and models.
- Set up and execute lab testing using: Thermocouples and temperature sensors, IR cameras for thermal imaging, Data acquisition systems (e.g., LabVIEW-based setups)
- Analyze test data and correlate with simulation results.
Required Qualifications
- Master’s or PhD in Mechanical Engineering, Aerospace Engineering, or related field with focus on heat transfer and fluid mechanics.
- 1–3 years of experience in thermal engineering or related field preferably in photonics applications.
- Strong fundamentals in heat transfer (conduction, convection, radiation) and fluid flow.
- Experience of CFD simulation tools for thermal analysis.
- Hands-on experience with thermal testing and instrumentation.
Preferred Skills
- Experience with simulation tools such as: Ansys Icepack / Ansys Electronics Desktop, Ansys Mechanical, SolidWorks (CAD and thermal modules).
- Programming and data analysis skills: MATLAB, Python scripting for test automation and data processing.
- Familiarity with electronics or photonics packaging is a plus
- Understanding of thermal reliability and material behavior (TIMs, interfaces, etc.)
