System on a Chip Architect | Omni Design Technologies, Inc. · Teeming.ai
Omni Design Technologies, Inc.
Omni Design Technologies, Inc. is a semiconductor IP company specializing in ultra-low power, high-performance embedded circuits built on advanced FinFET process nodes. Their product portfolio includes analog front-ends, data converters, linear regulators, PVT monitors, and specialty IP cores designed for SoC integration in wireless, automotive, optical, AI, aerospace, defense, data center, quantum computing, and communications applications. They offer chiplet and SoC solutions as hard macros or hardened chips, enabling customers to manufacture or leverage foundry partnerships. Omni Design focuses on accelerating AI infrastructure, enabling next-gen AI, efficient data centers, enhanced automotive safety, advanced wireless performance, satellite communications, and quantum computing. Their business model is primarily IP licensing and semiconductor embedded design ecosystem participation, serving semiconductor companies and system integrators globally.
AI infrastructureChipletsData convertersFinFETIP coresSemiconductorSoCUltra-low poweromnidesigntech.com
Omni Design Technologies, Inc.
Omni Design Technologies, Inc. is a semiconductor IP company specializing in ultra-low power, high-performance embedded circuits built on advanced FinFET process nodes. Their product portfolio includes analog front-ends, data converters, linear regulators, PVT monitors, and specialty IP cores designed for SoC integration in wireless, automotive, optical, AI, aerospace, defense, data center, quantum computing, and communications applications. They offer chiplet and SoC solutions as hard macros or hardened chips, enabling customers to manufacture or leverage foundry partnerships. Omni Design focuses on accelerating AI infrastructure, enabling next-gen AI, efficient data centers, enhanced automotive safety, advanced wireless performance, satellite communications, and quantum computing. Their business model is primarily IP licensing and semiconductor embedded design ecosystem participation, serving semiconductor companies and system integrators globally.
AI infrastructureChipletsData convertersFinFETIP coresSemiconductorSoCUltra-low poweromnidesigntech.com
HQMilpitas, US
Team Size113
Open Jobs8
Total Funding$35M
Latest Fundraise6 months ago
TL;DR
Founded: 2015
Headquarters: Milpitas, California
Focus: Ultra-low power, high-performance mixed-signal semiconductor IP and chiplets
Business model: IP licensing and semiconductor embedded design
Notable funding: Series A > $35M
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Company Overview
Problem Domain
Mixed-signal data acquisition and signal-processing IP to reduce power and increase performance in SoCs and chiplets for demanding applications.
Founded
2015
Industry
Semiconductor Manufacturing
Tech Stack
Next.js
Amazon
Funding Track Record
Series A
over $35,000,000
Described as an oversubscribed Series A with participation from Foothill Ventures, FM Capital, Tipping Point Ventures and other strategic investors.
Investor Signal
“Backed by semiconductor and electronics investors including CDIB-TEN (CDIB-Innolux), Foothill Ventures, FM Capital, Tipping Point Ventures”
Founders
What we do
Join the Team
System on a Chip Architect
HybridGreater Bengaluru Area, IN
Hybrid • Greater Bengaluru Area, IN
Wireless Communications Chip Architct and System Architect
About The Company
www.omnidesigntech.com
Omni Design is a leading provider of high-performance, ultra-low power IP solutions across advanced CMOS nodes, enabling differentiated SoC architectures for 5G, optical networks, LiDAR, radar, automotive networking, AI acceleration, imaging, and related high-growth markets. We partner with market leaders globally and are scaling rapidly. We are seeking senior technical leadership talent to define and guide the next generation of adaptive, multi-antenna wireless platforms.
Teeming tracks opportunities at over 24,000 AI startups, then works with you to find (and land) the one you'll love.
Data Scientist
Part-timeBerlin, DE
Part-time • Berlin, DE
Frontend Developer
ContractJerusalem
Contract • Jerusalem
Backend Developer
InternshipCambridge, GB
Internship • Cambridge, GB
Technical Writer
InternshipHaifa
Internship • Haifa
Software Engineer
InternshipAustin, US
Internship • Austin, US
Data Scientist
InternshipNovi Sad, RS
Internship • Novi Sad, RS
Job Description
We are seeking a Principal / Lead Wireless Communications System Architect to own the definition and architectural direction of complex wireless and multi-antenna system platforms. This individual will serve as the primary technical interface with customer system teams, lead system modeling and performance analysis, drive architectural decisions across mixed-signal and digital subsystems, and define system-level specifications that translate into silicon implementations.
This is a senior leadership role with substantial influence across product definition, roadmap direction, and customer engagement. The ideal candidate has a deep understanding of communications theory, system decomposition across analog/digital boundaries, quantization/error propagation, MIMO signal processing architectures, and end-to-end error budgeting strategies in SDR-based environments.
Key Responsibilities
Technical Leadership and Direction: Define system architecture for next-generation multi-antenna and SDR-based communication platforms, influencing product strategy and long-term roadmap planning.
Customer Technical Ownership: Lead technical engagement with strategic customers, representing system trade-offs, negotiating performance specifications, and aligning joint integration plans.
End-to-End System Modeling: Architect and maintain MATLAB and analytical models capturing the full signal chain, including channel modeling, quantization noise allocation, SNR budgeting, interplay of RF non-linearities, and DSP algorithm design constraints.
Block-Level Specification Ownership: Generate precise block-level specifications for digital baseband, calibration engines, channel processing, mixed-signal converters, and RF interfacing elements; ensure internal teams understand the architectural rationale behind these specifications.
Cross-Domain Integration: Drive alignment between digital architecture, signal processing algorithms, mixed-signal circuit selections, ADC/DAC dynamic range decisions, LO/subsystem noise considerations, and thermal/power constraints.
System Verification Alignment: Collaborate with validation and silicon bring-up teams to ensure post-silicon results trace back to modeled assumptions; define measurement-level KPIs and debug methodologies when deviations arise.
Mentorship & Team Development: Provide architectural guidance to system engineers, signal processing developers, and hardware design teams; develop reusable models, internal best practices, and system-level methodologies.
Thought Leadership: Participate in internal architecture reviews, contribute to core IP innovation strategy, and represent the company in technical engagements, standards-relevant discussions, and key customer milestones.
Qualifications
Graduate degree in Electrical Engineering, Communications Engineering, or related field; PhD strongly preferred.
15+years of experience in wireless communications system architecture for advanced SDR systems.
Demonstrated ownership of end-to-end communication signal chains, including cascaded error budgeting, quantization trade-offs, and performance modeling across RF, ADC/DAC, and DSP blocks.
Deep Expertise In
MIMO and multi-user spatial processing architectures,
Channel estimation,
SNR/phase-noise budgets and their mapping into mixed-signal design requirements
System-level modeling using MATLAB or Python,
Ability to articulate complex system decisions to both internal engineering teams and senior-level customers.
Proven leadership in defining specifications consumed by RTL design, mixed-signal design, verification, and system validation teams.
Strong customer communication skills and comfort presenting architectural trade-offs to VP- and CTO-level stakeholders.
