
Chipletz, founded in 2021, is a fabless semiconductor company that develops Smart Substrate™ products, an advanced packaging technology designed to overcome the limitations of Moore's Law by significantly enhancing system performance for AI workloads, immersive applications, and high-performance computing systems. Their technology eliminates the need for an interposer, enabling superior interconnects, faster external IO, and improved power integrity, positioning them to deliver next-generation computing system building blocks. The company is led by industry veterans from AMD and targets initial product delivery to customers and partners in 2025, aiming to revolutionize semiconductor in-package functionality with a focus on scalability and innovation in advanced packaging.

Chipletz, founded in 2021, is a fabless semiconductor company that develops Smart Substrate™ products, an advanced packaging technology designed to overcome the limitations of Moore's Law by significantly enhancing system performance for AI workloads, immersive applications, and high-performance computing systems. Their technology eliminates the need for an interposer, enabling superior interconnects, faster external IO, and improved power integrity, positioning them to deliver next-generation computing system building blocks. The company is led by industry veterans from AMD and targets initial product delivery to customers and partners in 2025, aiming to revolutionize semiconductor in-package functionality with a focus on scalability and innovation in advanced packaging.
Founded: 2021
Headquarters: Bee Cave / Austin, Texas
Product: Smart Substrate™ advanced packaging for chiplet integration
Target markets: AI, HPC, high-performance/immersive applications
Funding rounds recorded: Series B (Sep 11, 2023)
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Advanced semiconductor packaging and chiplet integration for high-performance computing and AI systems.
2021
Semiconductor Manufacturing
Company Description
Chipletz, incorporated in 2021, is a fabless substrate vendor specializing in advanced packaging technology designed to meet the rising need for high-performance computing. Its Smart Substrate™ products enable the integration of multiple integrated circuits (ICs) within a single package, optimizing performance and power delivery for critical AI workloads and other computationally intensive tasks. Chipletz is at the forefront of innovation in semiconductor substrate technology, driving advancement in computing density and efficiency.
Role Description
This is a full-time, on-site role located in the Austin, Texas Metropolitan Area. As a Supply Chain Operations Manager, you will manage the complex supply chain of an innovative start-up focused on delivering leading edge advanced packaging solutions for the emerging AI marketplace. Job scope includes ensuring timely delivery of material through each stage of manufacturing flow; coordinating procurement, logistics and flow between manufacturing sites, and proactively resolve delays and discrepancies; establishing and tracking supply chain metrics; ensuring compliance to applicable rules and regulations.
Requirements:
3-5yrs+ experience in managing a multi-node international supply chain and driving daily operations execution. Experience in designing and defining supply chain processes, systems and tools. B.S or M.S. in Operations Research, Industrial Engineering, Supply Chain or Business Management or related area. Proven track record in managing a semiconductor or complex electronics manufacturing supply chain and experience with enterprise supply chain applications such as SAP, Blue Yonder, Oracle, Kinaxis etc. Demonstrated ability to implement complex scripts and analytics in Excel
Qualifications
Ability to work independently in a dynamic and evolving environment. Experience in negotiations with suppliers to define and meet success criteria. Demonstrated capability in problem solving, data analysis and continuous improvement. Excellent communication and collaboration skills.