Eridu

Eridu AI provides semiconductor hardware that speeds up training for large artificial intelligence models. It achieves this through silicon and optics-based solutions designed to accelerate compute and data pathways used in model training. The approach falls under B2B hardware for AI development and data-center deployments, focusing on performance optimization for enterprise-scale models. The technology targets large-model training workloads and seeks to improve throughput and efficiency in AI infrastructure. The company positions itself at the intersection of advanced semiconductors, systems, and software to support scalable AI research and production.

eridu.ai

Eridu

eridu.ai

HQSaratoga, US

Team Size67

Open Jobs16

Total Funding-

Latest FundraiseUnknown

Join the Team

Sr. Thermal Engineer

On-SiteSaratoga, CA, US

On-Site • Saratoga, CA, US

Teeming tracks opportunities at over 24,000 AI startups, then works with you to find (and land) the one you'll love.

Product Designer

InternshipBerlin, DE

Internship • Berlin, DE

Mobile Developer

InternshipMunich, DE

Internship • Munich, DE

AI Researcher

Part-timeNovi Sad, RS

Part-time • Novi Sad, RS

Software Engineer

Part-timeJerusalem

Part-time • Jerusalem

Machine Learning Engineer

InternshipUtrecht, NL

Internship • Utrecht, NL

Machine Learning Engineer

Full-timeManchester, GB

Full-time • Manchester, GB

About Eridu AI Eridu AI is a Silicon Valley-based hardware startup pioneering infrastructure solutions that accelerate training and inference for large-scale AI models. Today’s AI performance is frequently limited by system-level bottlenecks. Eridu AI delivers multiple industry-first innovations across semiconductors, software, and systems to unlock greater GPU utilization, reduce capital and power costs, and maximize data center efficiency. The company’s solutions and value proposition have been validated by several leading hyperscalers.

The company is led by a veteran team of Silicon Valley executives and engineers with decades of experience in state-of-the-art semiconductors, optics, software, and systems, including serial entrepreneur Drew Perkins, co-founder of Infinera (NASDAQ: INFN), Lightera (acq. by Ciena), Gainspeed (acq. by Nokia) and Mojo Vision (World’s leading micro-LED company and developer of the first augmented reality contact lens).

About The Role We are seeking an innovative and experienced Senior Thermal Engineer to lead the thermal architecture, analysis, and validation of high-performance computing and communication hardware. This role requires deep expertise in electronics thermal management, system-level integration, and advanced cooling technologies, along with the ability to drive thermal design decisions across silicon, package, module, and system boundaries.

The Senior Thermal Engineer will work closely with mechanical, electrical, packaging, and manufacturing teams to ensure thermal solutions meet performance, reliability, and scalability requirements from concept through high-volume production.

Key Responsibilities

Minimum Qualifications

Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Engineering, or a related field
5+ years of experience in thermal engineering for electronics, with a proven track record of bringing products from concept to high-volume production
Strong knowledge of heat transfer and thermal management for electronics systems, including package- and system-level cooling
Experience with thermal simulation tools such as Icepak, Flotherm, COMSOL, or ANSYS
Familiarity with thermal validation, lab instrumentation, and data analysis
Strong written and verbal communication skills, with the ability to clearly document technical concepts and collaborate across cross-functional teams

Preferred Qualifications

10+ years of experience in thermal design for high-performance computing, AI, or communication hardware
Experience with advanced packaging and high-power-density modules (e.g., multi-die, chiplet-based systems)
Experience designing and deploying liquid cooling solutions, including cold plates, manifolds, and CDUs
Understanding of thermo-mechanical interactions such as warpage, CTE mismatch, and TIM behavior
Experience collaborating with ODMs, OSATs, and manufacturing partners to solve thermal and integration challenges
Experience with statistical or data analysis tools such as JMP is a plus

Why Join Us?

At Eridu AI, you’ll have the opportunity to shape the future of AI infrastructure, working with a world-class team on groundbreaking technology that pushes the boundaries of AI performance. Your contributions will directly impact the next generation of AI networking solutions, transforming data center capabilities.

The starting base salary for the selected candidate will be established based on their relevant skills, experience, qualifications, work location, market trends, and the compensation of employees in comparable roles.

Thermal Architecture & Design: Define and drive thermal architectures for rack-mounted systems, compute modules, and advanced packages, including air- and liquid-cooled solutions. Establish thermal requirements, budgets, and margins to meet system performance and reliability goals.

Thermal Modeling & Simulation: Develop and execute steady-state and transient thermal simulations at die, package, module, and system levels. Use simulation results to guide design tradeoffs, cooling technology selection, and system integration decisions.

Advanced Cooling Solutions: Design and evaluate thermal solutions including heat sinks, heat spreaders, cold plates, manifolds, TIMs, and system airflow. Support innovation in liquid cooling approaches for high-power, high-density electronics.

Prototyping & Testing: Define thermal test strategies and instrumentation plans. Execute thermal characterization, power mapping, and correlation of lab data with simulation results. Drive design iterations based on test outcomes.

Cross-Functional Collaboration: Partner closely with mechanical, electrical, packaging, and manufacturing engineers to ensure thermal considerations are integrated into system, enclosure, and package designs. Collaborate with external partners (ODMs, OSATs, cooling vendors) as needed.

Design for Manufacturability & Risk Mitigation: Apply thermal DFM principles early in the design cycle. Participate in FMEA activities, identify thermal risks, and lead mitigation strategies to address reliability, yield, and manufacturability challenges.

Documentation & Communication: Develop comprehensive thermal documentation, including requirements, specifications, simulation reports, test plans, and validation summaries. Present findings and recommendations to technical and non-technical stakeholders.

Quality & Reliability Support: Support qualification and reliability testing efforts, including thermal cycling and stress testing, and ensure compliance with relevant industry standards.