• Design and develop microfluidic cooling devices based on customer specifications.
• Utilize analytical and numerical modelling to support device design and performance optimization.
• Create mechanical components and assemblies for seamless integration between our product offerings and the customer requirements.
• Produce detailed technical drawings and oversee the manufacturing process maintaining high quality standards.
• Develop and implement specialized test setups to validate the cooling performance and packaging integrity of microfluidic solutions.
• Conduct experimental validation, including testing and data analysis, to characterize and refine prototype performance, ensuring optimal thermal and mechanical integration.
• Gather, analyse, and interpret data from experimental tests, using findings to inform and refine designs.
• Collaborate with customers to tailor solutions to specific HPC and AI platforms.
• Innovate advanced solutions for the mechanical integration of cooling devices into broader systems.
• Contribute to fundamental R&D activities within the Hardware team, fostering a collaborative environment.
• Research emerging technologies and trends in liquid cooling and thermal management. Drive the innovation of energy-efficient and environmentally sustainable cooling solutions.

Requirements:

• Education: M.Sc. in Mechanical Engineering, Microengineering, Materials Science, or a related field; a PhD is a plus.
• Experience: Minimum of 5 years relevant industrial experience in liquid cooling for electronic systems, ranging from R&D, product development, testing to industrialization. Ideally in data center applications.

Technical Expertise :

• Strong proficiency in mechanical design, tolerancing, and technical drawing for manufacturing.
• Prior experience in leading a new product from design into volume production.
• Advanced CAD skills (Solidworks preferred).
• Extensive hands-on experience designing thermal management solutions for GPUs, CPUs, or custom AI accelerators.
• Good understanding of advanced packaging (2.5D, 3D integration) and the associated challenges related to thermal management.
• Knowledge of packaging and mechanical integration of microfluidic systems in commercial HPC or AI platforms.
• Familiarity with materials science as it relates to thermal management and system reliability for liquid cooling applications.
• Familiarity with failure mechanisms for liquid cooling in data center applications, and the associated qualifications and tests.
• Direct experience with various manufacturing techniques for both prototyping and final production. Familiarity with 3D manufacturing for rapid prototyping.
• Deep understanding of heat transfer and fluid dynamics, particularly at the microscale.
• Practical experience designing and building cooling loops and test benches for microchannel-based cooling systems.
• Knowledge of industry standards and best practices for liquid cooling in HPC and data centres such as ASHRAE and OCP.
• Coding skills in Python and Arduino are a plus.
• Skilled in creating clear, high-quality technical documentation.

Soft Skills :

• Self-motivated and well-organized, with a high standard of work ethics.
• Excellent communication and interpersonal skills, able to collaborate with diverse teams.
• Strong problem-solving abilities and creative thinking, proactive in developing innovative solutions and proposing alternative ideas
• Fluent in English.

If you are excited about advancing liquid cooling technology for HPC and AI applications and meet the qualifications above, we’d love to hear from you!