
Eridu AI provides semiconductor hardware that speeds up training for large artificial intelligence models. It achieves this through silicon and optics-based solutions designed to accelerate compute…

Eridu AI provides semiconductor hardware that speeds up training for large artificial intelligence models. It achieves this through silicon and optics-based solutions designed to accelerate compute…
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About Eridu Eridu is a Silicon Valley-based hardware startup pioneering infrastructure solutions that accelerate AI data centers to deliver Faster AI . Today’s AI performance is frequently limited by communication bottlenecks. Eridu introduces multiple industry-first innovations across silicon, packaging, software, and systems to deliver an order of magnitude improvement in performance and unlock greater GPU utilization to speed training job completion times and tokens-per-second for more profitable inference. We do this while simultaneously reducing capital and power costs and improving reliability.
The company’s solutions and value proposition have been widely validated by leading hyperscalers.
Eridu has raised over $200M to date including its most recent, oversubscribed Series A round. The company is led by a veteran team of Silicon Valley executives who have delivered multiple billion dollar product lines and led multiple companies to billion dollar exits, including serial entrepreneur Drew Perkins, co-founder of Infinera (NASDAQ: INFN), Lightera (acq. by Ciena), Gainspeed (acq. by Nokia) and Mojo Vision (the world’s leading micro-LED company). The company is in execution mode and has a world-class engineering team with decades of experience in state-of-the-art silicon, packaging, optics, software, and systems. Eridu is working with best-in-class supply chain partners including silicon, packaging and systems.
Visit our website eridu.ai to learn more.
About The Role We are seeking an innovative and experienced Senior Liquid Cooling Thermal Engineer, including manifold design and its connectivity, to lead the thermal architecture, analysis, and validation of high-performance computing and communication hardware. This role requires deep expertise in electronics thermal management, system-level integration, and advanced cooling technologies, along with the ability to drive thermal design decisions across silicon, package, module, and system boundaries.
The Senior Thermal Engineer will work closely with mechanical, electrical, packaging, and manufacturing teams to ensure thermal solutions meet performance, reliability, and scalability requirements from concept through high-volume production..
Key Responsibilities
Minimum Qualifications
Preferred Qualifications
Why Join Us? At Eridu, you’ll have the opportunity to shape the future of AI infrastructure, working with a world-class team on groundbreaking technology that pushes the boundaries of AI performance. Your contributions will directly impact the next generation of AI infrastructure solutions, transforming the performance of AI data centers.
The starting base salary for the selected candidate will be established based on their relevant skills, experience, qualifications, work location, market trends, and the compensation of employees in comparable roles.
The Pay Range For This Role Is: $XXX,XXX – YYY,YYY USD per year (San Francisco Bay Area)
Notice to Recruiting Agencies Eridu does not accept unsolicited resumes or candidate profiles from staffing agencies or third-party recruiters. Any candidate submitted to Eridu without prior written authorization from our recruiting team will be considered unsolicited and will become the property of Eridu. Eridu reserves the right to pursue and hire such candidates without any obligation to pay fees. Recruiting agencies are expressly instructed not to contact hiring managers, employees, or executives regarding open positions.
The Pay Range For This Role Is: 225,000 - 275,000 USD per year(Saratoga, CA)
Thermal Architecture & Design:
Define and drive liquid cooling thermal architecture for rack-mounted systems, compute modules, and advanced packages. Establish thermal requirements, budgets, and margins to meet system performance and reliability goals.
Thermal Modeling & Simulation:
Develop and execute steady-state and transient thermal simulations at die, package (CoWoS, SoW), module, and system levels. Use simulation results to guide design tradeoffs, cooling technology selection, and system integration decisions.
Advanced Cooling Solutions:
Design and evaluate thermal solutions including cold plates, heat sinks, heat spreaders, manifolds, TIMs, and system airflow. Support innovation in liquid cooling approaches for high-power, high-density electronics.
Prototyping & Testing:
Define thermal test strategies and instrumentation plans. Execute thermal characterization, power mapping, and correlation of lab data with simulation results. Drive design iterations based on test outcomes.
Cross-Functional Collaboration:
Partner closely with mechanical, electrical, packaging, and manufacturing engineers to ensure thermal considerations are integrated into system, enclosure, and package designs. Collaborate with external partners (ODMs, OSATs, cooling vendors) as needed.
Design for Manufacturability & Risk Mitigation:
Apply thermal DFM principles early in the design cycle. Participate in FMEA activities, identify thermal risks, and lead mitigation strategies to address reliability, yield, and manufacturability challenges.
Documentation & Communication:
Develop comprehensive thermal documentation, including requirements, specifications, simulation reports, test plans, and validation summaries. Present findings and recommendations to technical and non-technical stakeholders.
Quality & Reliability Support:
Support qualification and reliability testing efforts, including thermal cycling and stress testing, and ensure compliance with relevant industry standards.