Chipright

Chipright is a specialist technology consultancy firm providing expert electronic consulting engineers for high-tech micro-electronic projects. They offer design services across hardware and software…

Analog DesignASIC VerificationConsultingEmbedded SoftwareFPGA DesignHardwareRecruitmentSemiconductorchipright.com

Chipright

Analog DesignASIC VerificationConsultingEmbedded SoftwareFPGA DesignHardwareRecruitmentSemiconductorchipright.com

HQGalway, IE

Team Size37

Open Jobs2

Total Funding-

Latest FundraiseUnknown

Join the Team

Senior Test Engineer

On-SiteMunich, Bavaria, DE

On-Site • Munich, Bavaria, DE

IC Test Engineer – High‑Speed Interfaces (Automotive)

📍 Munich, Germany | Fully Onsite

📅 Flexible start date

EU / German work authorisation required

Why this role?

This is a contract position with a chance to work at the cutting edge of high‑speed embedded IP , supporting complex automotive‑grade silicon from early architecture through to high‑volume production .

You’ll be hands‑on, influential, and working closely with design, quality, foundry, and OSAT partners on advanced nodes and interfaces.

If you enjoy silicon bring‑up, deep debug, and seeing your work move into production , this role will suit you.

What you’ll be doing

What we’re looking for

What’s on offer

Technically challenging, hands‑on test engineering work
Exposure to leading‑edge automotive silicon
Collaborative, engineering‑driven environment
Onsite role in Munich

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Collaborating with design teams early in the development cycle to review DFX architectures and define detailed test requirements

Developing test methodologies and content for high‑speed interfaces such as LPDDR4/5, PCIe Gen4/5, and MIPI (D/C/MPHY)

Creating and maintaining test programs , pattern conversion, and pre‑silicon validation using virtual simulation environments

Supporting load board and probe card design

Leading post‑silicon debug to enable timely delivery of engineering samples

Executing test characterisation and optimisation to meet automotive quality and reliability standards

Working closely with Quality & Reliability teams to implement qualification plans efficiently

Driving production test release with foundries and OSAT partners for wafer sort and final test

Bachelor’s or Master’s degree in Electronic Engineering (or equivalent)

7+ years’ experience in IC Product or Test Engineering

Proven hands‑on experience with silicon bring‑up and productisation of complex ICs

Strong understanding of RF test principles and methodologies

Experience with Teradyne UltraFlex / UltraFlexPlus test platforms (highly desirable)

Solid knowledge of DFT methodologies (Scan, MBIST, JTAG)

Strong programming skills in C/C++ , plus scripting ( Python, Perl ) in a Linux/Unix environment

Experience with data analysis and yield optimisation using statistical tools (e.g. JMP)

Familiarity with Verilog / RTL simulation is a plus