
We develop audacious AI computing platforms that elevate performance, energy and economic efficiencies, enabling our customers to rapidly deploy innovations in their AI applications.

We develop audacious AI computing platforms that elevate performance, energy and economic efficiencies, enabling our customers to rapidly deploy innovations in their AI applications.
What they do: Develop a Photonic Fabric optical interconnect platform to scale AI compute and memory bandwidth
Headquarters: Santa Clara, CA
Recent funding: Raised $175M Series C (Mar 2024) and $250M Series C1 (Mar 2025 reported)
Employee count (snapshot): 142
AI infrastructure: chip-to-chip and chip-to-memory interconnects to overcome memory wall and data-movement limits.
AI infrastructure / photonics
$100M
Reported to bring total raised at the time to >$165M
$175M
$250M
Reported valuation of $2.5B (Dealroom report)
“Participation from institutional investors including Fidelity, BlackRock, Tiger Global, U.S. Innovative Technology Fund, Temasek/Xora, Koch Disruptive Technologies, IAG Capital Partners, AMD Ventures, and others (reported across funding rounds).”
About Celestial AI As Generative AI continues to advance, the performance drivers for data center infrastructure are shifting from systems-on-chip (SOCs) to systems of chips. In the era of Accelerated Computing, data center bottlenecks are no longer limited to compute performance, but rather the system’s interconnect bandwidth, memory bandwidth, and memory capacity. Celestial AI’s Photonic Fabric™ is the next-generation interconnect technology that delivers a tenfold increase in performance and energy efficiency compared to competing solutions.
The Photonic Fabric™ is available to our customers in multiple technology offerings, including optical interface chiplets, optical interposers, and Optical Multi-chip Interconnect Bridges (OMIB). This allows customers to easily incorporate high bandwidth, low power, and low latency optical interfaces into their AI accelerators and GPUs. The technology is fully compatible with both protocol and physical layers, including standard 2.5D packaging processes. This seamless integration enables XPUs to utilize optical interconnects for both compute-to-compute and compute-to-memory fabrics, achieving bandwidths in the tens of terabits per second with nanosecond latencies.
This innovation empowers hyperscalers to enhance the efficiency and cost-effectiveness of AI processing by optimizing the XPUs required for training and inference, while significantly reducing the TCO2 impact. To bolster customer collaborations, Celestial AI is developing a Photonic Fabric ecosystem consisting of tier-1 partnerships that include custom silicon/ASIC design, system integrators, HBM memory, assembly, and packaging suppliers.
About The Role We are seeking a Senior SoC Design and integration Engineer to drive the design, integration, and implementation of SoCs, focusing on high-speed interconnects, IP integration, and ASIC execution. This role involves configuring, integrating, and supporting IP verification. It will include RTL design, synthesis, and working with the physical design team for timing closure.
We want to hear from you if you have expertise in SoC integration, high-speed interfaces, AXI interconnects, or ASIC implementation.
Essential Duties And Responsibilities SoC Design, IP Integration & Interconnects:
Qualifications Strong problem-solving skills with a methodical approach to debugging complex SoC issues are essential for this role. The ideal candidate should be able to collaborate effectively across multiple teams, including IP vendors, ASIC designers, verification engineers, and post-silicon teams, to ensure seamless integration and validation. Excellent written and verbal communication skills are critical for documenting design specifications, leading design reviews, and providing clear debugging reports.
Technical Expertise
Preferred Qualifications
LOCATION : Santa Clara, CA, or Orange County, CA
For California Location:
As an early stage start up, we offer an extremely attractive total compensation package inclusive of competitive base salary, bonus and a generous grant of our valuable early-stage equity. The target base salary for this role is approximately $185,000.00 - $225,000.00. The base salary offered may be slightly higher or lower than the target base salary, based on the final scope as determined by the depth of the experience and skills demonstrated by candidate in the interviews.
We offer great benefits (health, vision, dental and life insurance), collaborative and continuous learning work environment, where you will get a chance to work with smart and dedicated people engaged in developing the next generation architecture for high performance computing.
Celestial AI Inc. is proud to be an equal opportunity workplace and is an affirmative action employer.
Your next opportunity is in here somewhere. Sign up to explore 52,000+ startups and their open roles. No spam. No gamification. Just jobs.
52,000+
Startups
65,000+
Open Roles
1,500+
New This Week
SoC Design & RTL Integration:
Experience in RTL design and integration (Verilog/SystemVerilog).
Experience working on designs using interconnect protocols like AXI
Experience integrating high-speed interfaces (e.g. UCIe, CXL, PCIe, DDR)
Synthesis & ASIC Implementation:
Hands-on experience with logic synthesis, static timing analysis (STA), and low-power design techniques.
Familiarity with EDA tools for debugging, synthesis, and STA.
Knowledge of physical design constraints, floor planning, and timing closure.
Experience formal verification (logical equivalence check) to ensure synthesis correctness
Verification & Post-Silicon Debug:
Experience supporting pre-silicon verification (UVM, assertion-based verification, closing functional/code coverage).
Knowledge of post-silicon bring-up, validation, and debug techniques.
Programming & Scripting:
Proficiency in Tcl/Python for automation and debug.