Q.ANT builds photonic processors and quantum sensors that use light to improve energy efficiency and performance for AI and high-performance computing. The company develops native computing hardware…
AI AccelerationEnergy-Efficient AIHPCLight-based technologyNative ComputingNative SensingPhotonic ComputingQuantum Sensingqant.com
Q.ANT
Q.ANT builds photonic processors and quantum sensors that use light to improve energy efficiency and performance for AI and high-performance computing. The company develops native computing hardware…
AI AccelerationEnergy-Efficient AIHPCLight-based technologyNative ComputingNative SensingPhotonic ComputingQuantum Sensingqant.com
HQStuttgart, DE
Team Size74
Open Jobs10
Total Funding$72M
Latest Fundraise11 months ago
TL;DR
What they do: Build photonic processors, native processing servers and quantum sensors using thin‑film lithium niobate for energy‑efficient AI and HPC
Founded / HQ: 2018; Stuttgart, Germany
Founder / CEO: Dr. Michael Förtsch
Recent funding: €62M Series A announced July 17, 2025 (subsequent closes increased total to ~US$80M)
Data and AnalyticsDeepTechHardwareManufacturingSoftware
$91M
Your Mission
The future of AI computing is light, not electrons. Q.ANT is building photonic processing systems that compute with light, delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.
As
Senior Photonics Packaging Engineer (f/m/d)
, you will lead the specification, development, and verification of high-density photonic packaging solutions that integrate photonic integrated circuits (PICs), light sources, photodetectors, and analog circuitry into production-ready modules. You'll be the technical authority ensuring that supplier-delivered modules meet stringent optical, electrical, thermal, and mechanical requirements through precise definition of technical requirements, contractual agreements, and supplier project management.
What You Will Do:
Lead cross-functional coordination
across R&D, system engineering, manufacturing, and test teams to align packaging solutions with product architecture
Act as primary interface
for suppliers, managing technical goals, schedules, deliverables, contracts, and negotiations
Define complete packaging requirements
including optical coupling techniques, thermal management, RF signal integrity, and hermetic sealing methods
Plan and oversee multi-party R&D projects
, tracking milestones, budgets, and risks
What You Bring
What We Offer
We're looking for a technical leader who gets energized by developing novel photonic packaging solutions, managing supplier partnerships, and driving innovations that enable production systems already transforming AI computing.
Ready to define the packaging standards for photonic AI processors?
We are looking forward to receiving your application!
Q.ANT is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.
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Ensure supplier quality ratings
maintain ≥95% on-time delivery with zero critical defects and packaging costs within ±5% of targets
5+ years of experience
in
hybrid packaging, photonics assembly
, or
optoelectronic integration
Hands-on experience
with
PICs
,
laser sources
,
photodetectors
,
analog electronics
, and
mixed-signal integration
Deep expertise
in
optical coupling techniques
,
thermal management
for high-power photonic devices,
RF module design and signal integrity
, as well as
packaging materials
Proven track recordmanaging supplier-led R&D projects
from requirements through integration
Strong leadership, negotiation, and systems thinking
skills
Master's or PhD
in Photonics, Optoelectronics, Electrical Engineering, Physics, or a related field
Fluent in English
; German beneficial
Make impact at scale:
Help solve one of computing's biggest challenges—making growing demand in compute and sustainability go hand in hand
Work on the leading edge:
Photonic AI acceleration technologies that will define the next decade of computing - already validated in production HPC environments
Own your work from day one:
Broad autonomy and decision authority with direct impact on product success and the future of AI infrastructure
Fast-track your growth:
Work on challenges with few industry precedents—every problem you solve becomes new institutional knowledge and potentially industry-defining IP
World-class team:
Collaborate alongside a passionate, international, cross-functional team of experts in photonics, processor design, and AI systems
Direct access to leadership:
Work closely with the company's founders, including CEO Dr. Michael Förtsch, and advisory board members who shaped the semiconductor industry (ARM, Intel, Infineon)
Collaborative culture:
Innovative work environment that values technical excellence, open communication, and pragmatic problem-solving
Be part of history:
Join at the inflection point where photonic computing transitions from research to mainstream—your contributions will shape this transformation
