Title: Senior Package designer

Location: Greater Bengaluru Area

Founded in 2023,by Industry veterans HQ in California,US

About Company:

The organization is looking for exceptional talent and leadership to join us , the world’s first company developing Agentic Silicon for powering the future of AI.

Founded in 2023, It consists of 100+ highly skilled engineers from leading companies such as Intel, Marvell, Nvidia, Qualcomm, Cisco, AMD, Apple etc. We have deep customer engagements across America, Europe, and Asia, and demonstrated functional prototypes to prove our concept and vision.

Experience – 10+0 years

JOB DESCRIPTION:

Senior Package designer

Job Description:

Qualifications:

• More than 10+ years of experience in the flip chip BGA package design
• Experience working on the Large Formfactor, high layer count designs, Stack-up definition, Bump and ball map definition, Package outline drawings
• Very good understanding of the package design rules as well as design for manufacturing and successful tape out of multiple designs.
• Knowledge of Package level signal integrity and power integrity.
• Worked on High speed Serdes(PCIE Gen6, 112-224 G Ethernet) and memory interface like DDR5, LPDDR and HBM.

Responsibilities:

• Responsible for the package design of the Leading edge AI products for Tsavorite.
• Responsible for the feasibility studies for the new IP definition and Package design concepts.
• Owning the substrate layout design from start to end and taping out multiple products
• Co-design between Silicon, package and board.
• Collaborate closely with the Signal integrity, power integrity leads, PCB design, Mechanical and thermals to optimize the design to meet the product requirements.

Contact:

Sumit S. B.

Mulya Technologies

sumit@mulyatech.com

"Mining The Knowledge Community"