Responsibilities

• Mechanical Design: Design and optimize chassis, enclosures, cold plates, and mounting structures for rack-mounted systems, ensuring performance, structural integrity, thermal efficiency, and manufacturability.
• Packaging Design: Develop mechanical designs for IC and optical packages, including advanced packaging technologies (2.5D, 3D, SMT, solder ball attach) and novel cooling approaches. Photonics integration experience is a strong plus.
• Material Selection: Select materials based on thermal, mechanical, and electrical properties to meet reliability and performance goals. Collaborate with silicon, system, and packaging teams internally and externally (ODMs, OSATs, design houses).
• Prototyping & Testing: Build and test mechanical and packaging prototypes. Conduct validation testing (thermal cycling, shock, vibration) and iterate on design improvements.
• Cross-Functional Collaboration: Partner with electrical, thermal, and manufacturing engineers to integrate electrical/optical components into product designs and ensure functional compatibility.
• Design for Manufacturing & Root Cause Analysis: Apply DFM principles early in the design cycle. Lead FMEA, conduct root cause investigations, and resolve reliability and yield challenges.
• Documentation & Communication: Develop comprehensive documentation, including specifications, test plans, design reports, and manufacturing drawings. Present designs and findings to technical and non-technical stakeholders.
• Quality Assurance: Ensure compliance with industry standards and implement QA processes throughout the design and development lifecycle.

Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, or a related field
• 5+ years of experience in mechanical and packaging design, with a proven track record of bringing products from concept to high-volume production
• Strong knowledge of mechanical design for electronics systems, including chassis, board-level components, and packaging for high-speed electrical and optical interconnects
• Expertise in Design for Manufacturability (DFM), Failure Mode and Effects Analysis (FMEA), and root cause analysis methodologies
• Proficiency in 3D CAD tools such as SolidWorks, Creo, or AutoCAD
• Strong written and verbal communication skills, with the ability to clearly document technical concepts and collaborate across cross-functional teams

Preferred Qualifications

• 10+ years of experience in mechanical design and packaging for computing or communication hardware systems
• Familiarity with 2.5D/3D IC packaging, photonics integration, and substrate-level mechanical design
• Experience collaborating with ODMs, OSATs, and contract manufacturers to define manufacturing processes and solve DFM challenges
• Demonstrated innovation in mechanical architecture, system packaging, or high-density electronics integration
• Experience with advanced thermal solutions including cold plates, manifolds, and CDUs for liquid cooling is a plus
• Experience in simulation tools such as Ansys Mechanical, Icepak, or Flotherm is a plus
• Experience with quality and statistical analysis tools such as JMP is a plus

Why Join Us? At Eridu AI, you’ll have the opportunity to shape the future of AI infrastructure, working with a world-class team on groundbreaking technology that pushes the boundaries of AI performance. Your contributions will directly impact the next generation of AI networking solutions, transforming data center capabilities.

The starting base salary for the selected candidate will be established based on their relevant skills, experience, qualifications, work location, market trends, and the compensation of employees in comparable roles.

The Pay Range For This Role Is 210,000 - 265,000 USD per year(San Francisco Bay Area)