About Eridu
Eridu is a Silicon Valley-based hardware startup pioneering infrastructure solutions that accelerate training and inference for large-scale AI models. Today’s AI performance is frequently limited by system-level bottlenecks. Eridu AI delivers multiple industry-first innovations across semiconductors, software, and systems to unlock greater GPU utilization, reduce capital and power costs, and maximize data center efficiency. The company’s solutions and value proposition have been validated by several leading hyperscalers.
The company is led by a veteran team of Silicon Valley executives and engineers with decades of experience in state-of-the-art semiconductors, optics, software, and systems, including serial entrepreneur Drew Perkins, co-founder of Infinera (NASDAQ: INFN), Lightera (acq. by Ciena), Gainspeed (acq. by Nokia) and Mojo Vision (World’s leading micro-LED company and developer of the first augmented reality contact lens).
Position Overview
We are seeking an innovative and experienced Senior Mechanical Engineer to lead the design, integration, and validation of mechanical systems and advanced packaging for high-performance computing and communication hardware. This role requires a strong foundation in mechanical design, DFM, and system-level integration, as well as the ability to drive innovation in liquid cooling, IC packaging, and manufacturing processes.
Responsibilities
Minimum Qualifications
- Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, or a related field.
- 5+ years of experience in mechanical and packaging design, with a proven track record of bringing products from concept to high-volume production.
- Strong knowledge of mechanical design for electronics systems, including chassis, board-level components, and packaging for high-speed electrical and optical interconnects.
- Expertise in Design for Manufacturability (DFM), Failure Mode and Effects Analysis (FMEA), and root cause analysis methodologies.
- Proficiency in 3D CAD tools such as SolidWorks, Creo, or AutoCAD.
- Strong written and verbal communication skills, with the ability to clearly document technical concepts and collaborate across cross-functional teams.
Preferred Qualifications
- 10+ years of experience in mechanical design and packaging for computing or communication hardware systems.
- Familiarity with 2.5D/3D IC packaging, photonics integration, and substrate-level mechanical design.
- Experience collaborating with ODMs, OSATs, and contract manufacturers to define manufacturing processes and solve DFM challenges.
- Demonstrated innovation in mechanical architecture, system packaging, or high-density electronics integration.
- Experience with advanced thermal solutions including cold plates, manifolds, and CDUs for liquid cooling
Why Join Us?
At Eridu, you’ll have the opportunity to shape the future of AI infrastructure, working with a world-class team on groundbreaking technology that pushes the boundaries of AI performance. Your contributions will directly impact the next generation of AI networking solutions, transforming data center capabilities.
The starting base salary for the selected candidate will be established based on their relevant skills, experience, qualifications, work location, market trends, and the compensation of employees in comparable roles.
