Your mission
The future of AI computing is light. Q.ANT is building photonic processing systems that compute with light – delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.
As
Senior Photonics Packaging Engineer (f/m/d)
, you will lead the specification, development, and verification of high-density photonic packaging solutions that integrate photonic integrated circuits (PICs), light sources, photodetectors, and analog circuitry into production-ready modules. You'll be the technical authority ensuring that supplier-delivered modules meet stringent optical, electrical, thermal, and mechanical requirements through precise definition of technical requirements, contractual agreements, and supplier project management.
What makes this role unique:
- High complexity
: Developing novel high-density photonic packaging concepts that simultaneously address thermal management, optical alignment, RF signal integrity, and manufacturability – an area with few industry precedents
- Strategic freedom
: Broad autonomy to define requirements, select suppliers, and design technical strategies within strategic goals and budgetary limits
- Decision authority
: Direct influence on supplier relationships, product architecture decisions, and program economics
- innovation mandate: Implementation of at least one new packaging material, process, or architecture annually that becomes differentiating IP for the company
Within your first 18-24 months, you will:
- Achieve leading-edge integration density and performance
through innovative packaging architectures that enable our photonic processors to deliver up to 30x energy efficiency vs. conventional systems
- Minimize integration risks and rework
through rigorous supplier verification and quality assurance
- Contribute to competitive advantage
by accelerating time-to-market and optimizing cost-performance trade-offs in the rapidly scaling photonic computing market
Key responsibilities:
- Cross-functional leadership
: Coordinate internal R&D, system engineering, manufacturing, and test teams to align packaging solutions with overall product architecture
- Supplier engagement & interface role
: Act as the primary point of contact for suppliers, ensuring alignment on technical goals, schedules, and deliverables, including contract management and negotiation
-
: Plan and oversee multi-party R&D projects, tracking milestones, budgets, and risks, while ensuring deliverables are verified and integrated into final systems
Your profile
Education & Experience:
- More than 5 years of experience
in
hybrid packaging, photonics assembly, optoelectronic integration, or related high-density interconnect technologies
- Proven track record
in managing supplier-led R&D and packaging projects, from requirements definition through to integration and validation
- Hands-on experience
with PICs, laser sources, photodetectors, analog electronics, and mixed-signal integration
- Master's or PhD
in Photonics, Optoelectronics, Electrical Engineering, Physics, or a related field
Deep Technical Expertise in:
- Optical coupling techniques
(butt-coupling, lens coupling, fiber array integration)
- Thermal management strategies
for high-power photonic devices
- Understanding and enhancement of RF signal integrity
for highest performance in different high density interconnects
Tools & Processes:
- Familiarity with CAD tools
for photonics/electronics packaging, optical simulation software, and statistical process control
Leadership & Coordination Skills:
- Exceptional ability to lead cross-functional teams
across R&D, system engineering, manufacturing, and test domains
- Skilled in negotiation and contract management
with external suppliers and R&D partners
- Strong systems thinking
to balance optical, electrical, thermal, and mechanical requirements simultaneously
- Excellent communication skills
with the ability to translate complex technical trade-offs to management and stakeholders
Languages:
- Fluent in English
; German or other European language beneficial
Preferred Qualifications:
- Experience with photonic integrated circuit (PIC) packaging
for AI or HPC applications
- Knowledge of high-speed digital interfaces
and their integration with photonic systems
- Familiarity with scaling systems
from prototype to volume production
- Understanding of supply chain management and material supplier ecosystems
in photonics
Why us?
We're looking for a technical leader who gets energized by developing novel photonic packaging solutions, managing supplier partnerships, and driving innovations that enable production systems to transform AI computing already today.
Ready to shape the future of photonic integration?
We are looking forward to receiving your application!
Q.ANT is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.
