
Omni Design Technologies, Inc. is a semiconductor IP company specializing in ultra-low power, high-performance embedded circuits built on advanced FinFET process nodes. Their product portfolio includes analog front-ends, data converters, linear regulators, PVT monitors, and specialty IP cores designed for SoC integration in wireless, automotive, optical, AI, aerospace, defense, data center, quantum computing, and communications applications. They offer chiplet and SoC solutions as hard macros or hardened chips, enabling customers to manufacture or leverage foundry partnerships. Omni Design focuses on accelerating AI infrastructure, enabling next-gen AI, efficient data centers, enhanced automotive safety, advanced wireless performance, satellite communications, and quantum computing. Their business model is primarily IP licensing and semiconductor embedded design ecosystem participation, serving semiconductor companies and system integrators globally.

Omni Design Technologies, Inc. is a semiconductor IP company specializing in ultra-low power, high-performance embedded circuits built on advanced FinFET process nodes. Their product portfolio includes analog front-ends, data converters, linear regulators, PVT monitors, and specialty IP cores designed for SoC integration in wireless, automotive, optical, AI, aerospace, defense, data center, quantum computing, and communications applications. They offer chiplet and SoC solutions as hard macros or hardened chips, enabling customers to manufacture or leverage foundry partnerships. Omni Design focuses on accelerating AI infrastructure, enabling next-gen AI, efficient data centers, enhanced automotive safety, advanced wireless performance, satellite communications, and quantum computing. Their business model is primarily IP licensing and semiconductor embedded design ecosystem participation, serving semiconductor companies and system integrators globally.
Founded: 2015
Headquarters: Milpitas, California
Focus: Ultra-low power, high-performance mixed-signal semiconductor IP and chiplets
Business model: IP licensing and semiconductor embedded design
Notable funding: Series A > $35M
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Mixed-signal data acquisition and signal-processing IP to reduce power and increase performance in SoCs and chiplets for demanding applications.
2015
Semiconductor Manufacturing
over $35,000,000
Described as an oversubscribed Series A with participation from Foothill Ventures, FM Capital, Tipping Point Ventures and other strategic investors.
“Backed by semiconductor and electronics investors including CDIB-TEN (CDIB-Innolux), Foothill Ventures, FM Capital, Tipping Point Ventures”
Principal / Lead Wireless Communications System Architect US, Europe Full-Time / Consultant Wireless Communications, Software-Defined Radio (SDR), Semiconductor IP and Advanced SoC Omni Design Technologies is a leading provider of high-performance, ultra-low power IP solutions across advanced CMOS nodes, enabling differentiated SoC architectures for 5G, optical networks, LiDAR, radar, automotive networking, AI acceleration, imaging, and related high-growth markets. We partner with market leaders globally and are scaling rapidly. We are seeking senior technical leadership talent to define and guide the next generation of adaptive, multi-antenna wireless platforms. We are seeking a to own the definition and architectural direction of complex wireless and multi-antenna system platforms. This individual will serve as the primary technical interface with customer system teams, lead system modeling and performance analysis, drive architectural decisions across mixed-signal and digital subsystems, and define system-level specifications that translate into silicon implementations.This is a with substantial influence across product definition, roadmap direction, and customer engagement. The ideal candidate has a deep understanding of communications theory, system decomposition across analog/digital boundaries, quantization/error propagation, MIMO signal processing architectures, and end-to-end error budgeting strategies in SDR-based environments. Define system architecture for next-generation multi-antenna and SDR-based communication platforms, influencing product strategy and long-term roadmap planning. Lead technical engagement with strategic customers, representing system trade-offs, negotiating performance specifications, and aligning joint integration plans. Architect and maintain MATLAB and analytical models capturing the full signal chain, including channel modeling, quantization noise allocation, SNR budgeting, interplay of RF non-linearities, and DSP algorithm design constraints. Generate precise block-level specifications for digital baseband, calibration engines, channel processing, mixed-signal converters, and RF interfacing elements; ensure internal teams understand the architectural rationale behind these specifications. Drive alignment between digital architecture, signal processing algorithms, mixed-signal circuit selections, ADC/DAC dynamic range decisions, LO/subsystem noise considerations, and thermal/power constraints. Collaborate with validation and silicon bring-up teams to ensure post-silicon results trace back to modeled assumptions; define measurement-level KPIs and debug methodologies when deviations arise. Provide architectural guidance to system engineers, signal processing developers, and hardware design teams; develop reusable models, internal best practices, and system-level methodologies. Participate in internal architecture reviews, contribute to core IP innovation strategy, and represent the company in technical engagements, standards-relevant discussions, and key customer milestones. Graduate degree in Electrical Engineering, Communications Engineering, or related field; PhD strongly preferred.12+years of experience in wireless communications system architecture for advanced SDR systems.Demonstrated ownership of , including cascaded error budgeting, quantization trade-offs, and performance modeling across RF, ADC/DAC, and DSP blocks.Deep expertise in: MIMO and multi-user spatial processing architectures, Channel estimation, SNR/phase-noise budgets and their mapping into mixed-signal design requirementsSystem-level modeling using Ability to articulate complex system decisions to both internal engineering teams and senior-level customers.Proven leadership in defining specifications consumed by RTL design, mixed-signal design, verification, and system validation teams.Strong customer communication skills and comfort presenting architectural trade-offs to VP- and CTO-level stakeholders. Highly competitive compensation, performance incentives, and substantial technical influence.Direct ownership of architecture direction for multiple next-generation communication product lines.Opportunity to shape strategic relationships with top-tier global customers.A technical culture that values rigor, clarity, and architectural craftsmanship.We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.