
The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated circuits smaller, and packing more of them together, to achieve more powerful and efficient chips. However, all power that goes into these billions of transistors is turned into heat. This heat needs to be extracted, as overheating causes chips to fail and lose performance. With transistors approaching the size of a few atoms, extracting this highly concentrated heat is rapidly becoming a bottleneck for the next generations of computing. In addition, cooling of chips accounts for about 30% of electricity consumption in data centers, causing an enormous environmental footprint. Sustainable and high-performance heat extraction is key to satisfy our ever-increasing demand for computational power. We are a provider of breakthrough semiconductor cooling solutions. Our solution utilizes a network of microscopically small cooling channels embedded inside the chip, which enables us to extract 10 times more heat compared to the current leading market alternatives, and extract this heat over 50x more energy efficiently. This enables the powerful integrated circuits of the future to break thermal limitations in a sustainable manner.

The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated circuits smaller, and packing more of them together, to achieve more powerful and efficient chips. However, all power that goes into these billions of transistors is turned into heat. This heat needs to be extracted, as overheating causes chips to fail and lose performance. With transistors approaching the size of a few atoms, extracting this highly concentrated heat is rapidly becoming a bottleneck for the next generations of computing. In addition, cooling of chips accounts for about 30% of electricity consumption in data centers, causing an enormous environmental footprint. Sustainable and high-performance heat extraction is key to satisfy our ever-increasing demand for computational power. We are a provider of breakthrough semiconductor cooling solutions. Our solution utilizes a network of microscopically small cooling channels embedded inside the chip, which enables us to extract 10 times more heat compared to the current leading market alternatives, and extract this heat over 50x more energy efficiently. This enables the powerful integrated circuits of the future to break thermal limitations in a sustainable manner.
What they do: Silicon microfluidic cooling: microscopic liquid-cooling channels embedded for high-power chips (data center / HPC / AI).
Founded / HQ: Founded 2022 — Lausanne, Switzerland (EPFL Innovation Park).
Technology advantage: Embedded micro-channel / microfluidic approach claimed to extract ~10x more heat and be ~50x more energy efficient vs leading alternatives.
Latest funding: $25.0M Series A1 (2025) — company & Dealroom cite Applied Digital as lead; other listings identify BlueYard Capital.
Notable investors: Applied Digital, BlueYard Capital, XTX Ventures, Founderful, Lip-Bu Tan, Celsius Industries, Acequia Capital.
Thermal management for high-power compute (data centers, AI accelerators, HPC).
2022
Computers and Electronics Manufacturing
Seed round (announced Jan 21, 2022); participating angels and investors reported in investor listings.
$25.0M
Company and Dealroom list a $25M Series A1 led by Applied Digital; other investor listings identify BlueYard Capital as a lead for the Series A.
“Reported investors include Applied Digital, BlueYard Capital, XTX Ventures, Founderful, Lip-Bu Tan, Celsius Industries, Acequia Capital; non-dilutive support items reported include Intel Ignite, Venture Kick, and Prix Strategis.”
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We are looking for an experienced NPI Engineer (Process Engineer) to define, oversee and optimize our NPI development suppliers and manufacturing processes. The successful candidate will be responsible for identifying areas for improvement, implementing solutions, and ensuring the efficiency and effectiveness of our development, NPI and production operations. This role requires strong analytical skills, technical expertise, and the ability to work cross-functionally to drive continuous improvement initiatives. Experience in additive manufacturing will be highly appreciated, particularly in powder-based processes involving sintering.
About us: Corintis is a provider of advanced semiconductor cooling technologies. Some of the biggest challenges of our lifetime, from climate modeling to drug discovery, require ever increasing computing resources. As more specialized and powerful chips are being deployed in data centers all over the world, the efficient cooling of these large computing clusters has become a major economic and environmental concern.
In fact, the electricity consumption devoted to data center cooling in the near future is estimated to match the combined consumption of London and New York. Moreover, next-generation chip designs are expected to be limited by current cooling technologies.
At Corintis, we address these challenges by integrating cooling directly inside the silicon chip. By doing so, we aim to enable the sustainable computing of the future and allow other innovators to work on the biggest global challenges. Today, we are working alongside some of the biggest names in the industry to enable the next generation of sustainable high-performance data centers.
Responsibilities:
Qualifications & Skills