
The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated…

The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated…
Headquarters: Lausanne, Switzerland
Product: Microfluidic liquid cooling (microfluidic cold plates and co‑packaged cooling) for high‑power chips
Claimed performance: Up to 10x more heat extraction and 50x better energy efficiency vs current alternatives
Recent financing: Series A activity (reported €20M round; total disclosed funding ~€28.5M)
Thermal management of high‑performance semiconductor chips used in data centers, HPC, and AI workloads.
Computers and Electronics Manufacturing
€20M
Reported Series A round of €20M (Dealroom/Crunchbase summaries)
USD 25M
Company site states a $25M Series A1 led by Applied Digital
Reported prior seed and grant support (Venture Kick, Intel Ignite, Prix Strategis)
We are looking for an experienced NPI Engineer (Process Engineer) to define, oversee and optimize our NPI development suppliers and manufacturing processes. The successful candidate will be responsible for identifying areas for improvement, implementing solutions, and ensuring the efficiency and effectiveness of our development, NPI and production operations. This role requires strong analytical skills, technical expertise, and the ability to work cross-functionally to drive continuous improvement initiatives. Experience in additive manufacturing will be highly appreciated, particularly in powder-based processes involving sintering.
About us: Corintis is a provider of advanced semiconductor cooling technologies. Some of the biggest challenges of our lifetime, from climate modeling to drug discovery, require ever increasing computing resources. As more specialized and powerful chips are being deployed in data centers all over the world, the efficient cooling of these large computing clusters has become a major economic and environmental concern.
In fact, the electricity consumption devoted to data center cooling in the near future is estimated to match the combined consumption of London and New York. Moreover, next-generation chip designs are expected to be limited by current cooling technologies.
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At Corintis, we address these challenges by integrating cooling directly inside the silicon chip. By doing so, we aim to enable the sustainable computing of the future and allow other innovators to work on the biggest global challenges. Today, we are working alongside some of the biggest names in the industry to enable the next generation of sustainable high-performance data centers.
Responsibilities:
Qualifications & Skills