Avicena is a privately held company headquartered in Sunnyvale, California, with a development center in Edinburgh, Scotland, developing microLED-based ultra-low power, high bandwidth interconnects…
Avicena is a privately held company headquartered in Sunnyvale, California, with a development center in Edinburgh, Scotland, developing microLED-based ultra-low power, high bandwidth interconnects…
Avicena
is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products. (www.avicena.tech)
About The Role
This position involves developing and supporting mechanical designs for advanced packaging & optical components and systems. The mechanical engineer will collaborate closely with cross-functional engineering teams to capture product concepts, document component, and process flows, and perform analytical studies on material and packaging design that meets final product requirements.
Responsibilities
Design and develop advanced packaging solutions using CAD tools (primarily SolidWorks), including detailed 3D models and 2D engineering drawings that meet industry standards and internal guidelines.
Collaborate closely with manufacturing and operations teams to ensure successful implementation of packaging designs, providing hands-on engineering support during production ramp and issue resolution.
Document component flow across assembly, test, and packaging processes to support design decisions and manufacturing readiness.
Support material and package selection, including epoxies, mechanical housings, and other structural components, with consideration for performance, reliability, and manufacturability.
Qualifications
Bachelor’s degree in Mechanical Engineering, Materials Engineering, or a related field, with 3+ years of experience in semiconductor advanced packaging and design.
Strong proficiency in SolidWorks for 3D modeling and 2D drafting; experience with SolidWorks Visualize or similar rendering tools preferred.
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Perform mechanical analyses such as thermal, structural, strain, and root-sum-square (RSS) tolerance analysis to ensure robustness and reliability of package designs.
Create clear visualizations and renderings for design reviews, technical discussions, and stakeholder presentations.
Contribute to continuous improvement of engineering documentation, design standards, and development workflows.
Solid understanding of mechanical design principles, materials behavior, and design for assembly and manufacturability (DFM/DFA).
Experience performing thermal and structural analyses; familiarity with Ansys or equivalent multiphysics simulation tools is a plus.
Working knowledge of JEDEC and other relevant packaging standards.
Strong understanding of packaging materials, manufacturing processes, and quality/regulatory requirements.
Proficient in Microsoft Office tools for documentation, reporting, and presentations.
Excellent communication, documentation, and cross-functional collaboration skills.
Proven ability to manage multiple projects, work independently, and meet deadlines in a fast-paced environment.
Strong analytical thinking and problem-solving skills.
