At iPronics, packaging is a critical enabler of performance, reliability, and scalability in our photonic systems. As we continue to bring our technology to production, we are expanding our team with a
III-V Photonics Packaging Engineer
to drive advanced packaging solutions for next-generation photonic integrated circuits.
This role sits at the core of product industrialization, bridging design, manufacturing, and system integration.
What You’ll Do
As a Photonics Packaging Engineer, you will lead the development and optimization of packaging solutions for III-V photonic integrated circuits.
Your responsibilities will include:
- Designing mechanical, thermal, and optical packaging solutions for PICs (fiber coupling, lens arrays, hybrid integration).
- Developing and qualifying packaging processes to achieve high performance and scalable manufacturing.
- Collaborating with suppliers to qualify production lines and improve manufacturing processes.
- Performing multiphysics simulations (thermal, mechanical, optical coupling).
- Applying Design for Manufacturability (DfM) principles to ensure cost-effective scaling.
- Defining and executing reliability and qualification strategies (DOE, FMEA, accelerated testing).
- Driving failure analysis and continuous improvement of packaging solutions.
- Collaborating with system, photonic, and hardware teams to ensure full integration.
- Maintaining detailed technical documentation.
What We’re Looking For
Education & Experience
- PhD or Master’s degree in Photonics, Electrical Engineering, Physics, or related field.
- 5+ years of experience in photonic packaging, particularly III-V PICs.
Technical Expertise
- Strong knowledge of packaging processes and materials (flip-chip, wire bonding, fiber attach, alignment, adhesives, carriers).
- Experience with CAD tools such as SolidWorks.
- Experience with thermal and thermo-mechanical simulations.
- Knowledge of optical simulation tools (ZEMAX, CODEV).
- Experience with DfM and DfT methodologies.
- Solid Python programming skills.
Nice to Have
- Experience with reliability testing and standards.
- PCB design knowledge.
Soft Skills
- Strong problem-solving and analytical skills.
- Team player with strong communication abilities.
- Ability to work in multidisciplinary environments.
What We Offer
- Permanent full-time position
- Hybrid work model
- Flexible working hours
- December 24th and 31st off
- One extra day off during your birthday month
- Private health insurance
- Pension plan included
- Flexible compensation plan (restaurant tickets, transport, and childcare vouchers)
- Opportunity to work on advanced photonic packaging for AI and datacenter technologies
Why Join iPronics?
At iPronics, packaging is not just a final step — it is a key driver of performance and scalability. You will play a central role in bringing cutting-edge photonic technologies from concept to high-volume production.
