Siliconova designs high-performance, low-power processors and system-on-chip solutions for embedded and data center contexts. They develop 32/64-bit CPUs, MCUs, RISC and RISC-V cores, memory, RAM, SSD, ASICs, FPGAs, and AI knowledge-based processors. Their offerings target embedded systems, IoT, automotive, 5G, and other wired and wireless devices. Core technologies include ASIC, FPGA, CPU cores, RAM/SSD components, and AI accelerators. The company serves hardware manufacturers and system integrators seeking compact, efficient silicon for specialized applications.
Siliconova designs high-performance, low-power processors and system-on-chip solutions for embedded and data center contexts. They develop 32/64-bit CPUs, MCUs, RISC and RISC-V cores, memory, RAM, SSD, ASICs, FPGAs, and AI knowledge-based processors. Their offerings target embedded systems, IoT, automotive, 5G, and other wired and wireless devices. Core technologies include ASIC, FPGA, CPU cores, RAM/SSD components, and AI accelerators. The company serves hardware manufacturers and system integrators seeking compact, efficient silicon for specialized applications.
We are seeking passionate engineers with strong interest and expertise in
Material Science, Metallurgy, Basic Electronics and IC Package Engineering
to join our growing team.
Key Responsibilities
Teeming tracks opportunities at over 24,000 AI startups, then works with you to find (and land) the one you'll love.
Software Engineer
Full-timeUtrecht, NL
Full-time • Utrecht, NL
Backend Developer
ContractBerlin, DE
Contract • Berlin, DE
Data Scientist
ContractHaifa
Contract • Haifa
Backend Developer
Full-timeNew York, US
Full-time • New York, US
Backend Developer
ContractSan Francisco, US
Contract • San Francisco, US
Backend Developer
Full-timeTel Aviv
Full-time • Tel Aviv
IC package
layout and substrate design
Mechanical and material design for advanced IC packages
Material engineering
analysis for package reliability and performance
Signal Integrity (SI) and Power Integrity (PI) analysis
Power Delivery Network (PDN) design and optimization
Collaboration with cross-functional teams including silicon, system, and manufacturing engineers
Support package development from concept through production
Strong interest or experience in: IC package & substrate design, Mechanical design for semiconductor packaging, Material selection and characterization, SI/PI analysis and PDN design, Knowledge of semiconductor packaging technologies is a plus
Strong analytical, problem-solving, and teamwork skills
Fresher University Graduates are highly encouraged to apply
Application with relevant experience will get preference
What We Offer
Work with cutting-edge semiconductor technologies
Exposure to
global projects and teams
Clear
career growth and international relocation opportunities
(Application might not be accepted if subject line doesn't match)
Application Deadline:10th January 2026
Company Description
SILICONOVA Limited is a leading semiconductor design company delivering next-generation solutions in advanced IC packaging and system integration. We work at the intersection of materials engineering, mechanical design, and high-performance electronics, enabling reliable and scalable semiconductor products for global markets.
Siliconova specializes in the design, packaging, and testing of advanced semiconductor devices, including CPUs, MCUs, RISC and RISC-V processors, AI processors, memory, ASICs, SOCs, and FPGAs for diverse applications. Our technology powers essential devices across industries such as IoT, wireless communications, automotive, 5G, and PC computing. We are dedicated to creating high-performance, low-power 32/64-bit processors and their associated SoCs to cater to the rapidly evolving embedded systems market globally. Our commitment to innovation positions us as a key player in shaping next-generation technologies.
As we continue to expand, SILICONOVA offers long-term global career growth, with future relocation opportunities to:
