Augmodo is at the forefront of Spatial AI, where mapping connects the digital and physical worlds, through devices such as smart badges at retail stores. We are seeking a Systems Integration Engineer with deep experience in board bring-up, hardware validation, and embedded system integration, especially for platforms involving MIPI cameras, ISP pipelines, and wireless connectivity. You will play a central role in bringing up new boards, enabling hardware interfaces, and debugging system-level issues across the hardware-software boundary. This role is ideal for engineers who thrive in low-level debugging, cross-functional hardware interactions, and camera sensor system tuning—not pure firmware development. * Lead initial board bring-up of embedded Linux or Android-based systems (e.g. Qualcomm, Rockchip, NXP, or custom platforms). * Validate and enable hardware interfaces including MIPI CSI/DSI, ISP, Wi-Fi, SPI, CAN, and I2C. * Work hands-on with new PCB builds to validate power rails, clocks, and connectivity; bring up peripherals and core components. * Collaborate with camera vendors and ISP teams to tune image quality and integrate sensor drivers into the stack. * Debug cross-layer issues spanning bootloaders (U-Boot), device trees, drivers, kernel logs, and vendor blobs. * Serve as the technical point of contact for hardware ODMs and component vendors, especially in Asia. * Support integration of system services, thermal management, and power profiling at the board level. * Provide feedback to hardware teams during design and EVT/DVT/PVT stages. * Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field. * 5+ years of experience in embedded system bring-up or hardware validation roles. * Proficiency in Linux or Android platform bring-up, device tree configuration, and low-level debug tools. * Strong hands-on experience with oscilloscopes, logic analyzers, and debugging hardware interfaces (MIPI, SPI, etc.). * Experience with camera systems, including MIPI camera sensor tuning and integration with ISP stacks. * Familiarity with wireless modules (Wi-Fi/BT) and debugging RF-level integration issues. * Comfort working with remote hardware teams and manufacturers, including review of schematics and PCB layouts. * Bonus: Exposure to BSP development or integration experience with Rockchip, Qualcomm, or other SoC vendors. $155,000 - $210,000 USD + Equity