Eliyan
Eliyan delivers high-bandwidth, low-power die-to-die connectivity to enable large multi-die systems that boost AI and compute performance. The company develops a PHY-based interconnect technology called NuLink™ (and related Bunch of Wires) that implements chiplet connectivity over standard organic and silicon substrates, supporting industry standards like UCIe as well as custom interfaces. Eliyan licenses its IP and provides custom chiplet connectivity solutions to semiconductor companies and AI chip designers, targeting Systems-in-Package (SiP) and chiplet-based architectures. Its technology improves bandwidth and power efficiency for AI, automotive, and advanced consumer systems while reducing packaging cost and complexity.
Eliyan
Eliyan delivers high-bandwidth, low-power die-to-die connectivity to enable large multi-die systems that boost AI and compute performance. The company develops a PHY-based interconnect technology called NuLink™ (and related Bunch of Wires) that implements chiplet connectivity over standard organic and silicon substrates, supporting industry standards like UCIe as well as custom interfaces. Eliyan licenses its IP and provides custom chiplet connectivity solutions to semiconductor companies and AI chip designers, targeting Systems-in-Package (SiP) and chiplet-based architectures. Its technology improves bandwidth and power efficiency for AI, automotive, and advanced consumer systems while reducing packaging cost and complexity.
