Role Overview

We’re looking for a senior leader to drive Module Development for next-generation ELSFP external laser modules. This person will own the full development of highly integrated modules that bring together PCB electronics, photonics, packaging, and thermal design into a product that can scale in manufacturing.

The role requires leading cross-functional engineering teams to deliver high-performance, low-noise, and thermally stable laser modules from early concept through volume production, while also shaping the architecture and development path for future generations.

Key Responsibilities

Module Architecture & Development

• Own end-to-end module development, including:
• PCB design for laser drivers, TEC control, and monitoring circuits
• Optical subassemblies and laser integration
• Mechanical packaging and thermal design
• Define overall module architecture and make design trade-offs across performance, cost, power, and manufacturability
• Drive tight optical, electrical, and thermal co-design within ELSFP constraints

Engineering Leadership

• Build and lead a multidisciplinary module development team across:
• PCB / electronics
• Mechanical / thermal engineering
• Test and validation
• Set technical direction, lead design reviews, and maintain a high bar for execution
• Establish strong practices for design, integration, debug, and validation

Execution & Delivery

• Drive development from prototype through qualification (EVT/DVT/PVT) and production ramp
• Partner closely with TPM and operations to deliver on schedule
• Own key module metrics including noise, stability, yield, reliability, and cost

PCB & Electronics

• Oversee development of low-noise, high-performance PCBs that are critical to laser stability
• Ensure strong power integrity, signal integrity, and EMI performance
• Guide integration of:
• Laser drivers
• TEC controllers and thermal feedback loops
• Photodiode sensing and control systems

Manufacturing & Supply Chain

• Define module assembly flow, test strategy, and calibration processes
• Work closely with CMs, ODMs, and suppliers on:
• PCB fabrication and assembly
• Laser and optical component sourcing
• Module packaging and alignment
• Drive DFM/DFT, yield improvement, and cost reduction

Reliability & Quality

• Ensure compliance with reliability and qualification requirements
• Lead failure analysis and root-cause resolution across module and PCB-related issues

Required Qualifications

• BS or MS in Electrical Engineering, Photonics, Physics, or a related field
• 12–15+ years of experience in optical modules or other complex hardware systems
• 5+ years of leadership experience in module, subsystem, or product development
• Strong technical depth in:
• PCB design, including mixed-signal, low-noise, PI/SI considerations
• Module and system integration
• Proven track record of bringing hardware products into volume production

Preferred Qualifications

• Experience with ELSFP, QSFP-DD, CFP2, or similar optical modules
• Background in tunable or coherent laser systems
• Familiarity with:
• TEC-based thermal control
• Optical packaging and alignment
• Stabilization control loops and supporting firmware
• Experience working in startup or fast-scaling environments