Responsibilities:
1. Strategic & Technical Leadership
- Define the software and control technology roadmap supporting advanced packaging processes such as underfill jetting, TIM dispensing, flip-chip, chiplet-to-interposer bonding, and wafer-to-wafer hybrid integration.
- Lead multi-disciplinary teams in software architecture, motion control, computer vision, and data analytics for high-precision automation platforms.
- Align software development priorities with corporate R&D goals in sub-10-micron EHD jetting and multi-nozzle MEMS printhead systems.
- Mentor and grow a high-performing team of software engineers capable of supporting complex mechatronic and process-driven systems.
2. Software Architecture & System Integration
- Architect modular, scalable, and reusable software frameworks that unify motion, vision, jetting, and AI feedback across NSW product lines.
- Ensure deterministic real-time control for multi-axis motion, synchronized jetting, and droplet metrology with submicron accuracy.
- Lead integration of process modules such as flux cleaning, plasma, curing, and inspection into unified automation platforms.
- Oversee communication layer design using EtherCAT, OPC-UA, Modbus, and proprietary protocols to ensure interoperability across machine subsystems.
3. Product Development & Execution
- Translate semiconductor and packaging process requirements into executable software deliverables.
- Oversee the development of intuitive HMIs, data logging, recipe management, and closed-loop control systems.
- Manage concurrent software projects supporting new product introductions and customer-specific customizations.
- Collaborate with process, mechanical, and electrical engineering teams to ensure cohesive system performance and manufacturability.
- Drive joint-development projects with OEMs, controller vendors, and automation partners to accelerate system integration and feature enhancement.
4. Advanced Packaging Process Enablement
- Work closely with process and customer to implement AI/ML algorithms for related process control.
- Lead software development for inline inspection and metrology systems (vision-based droplet detection, alignment correction, defect mapping).
- Support new applications in fan-out wafer-level packaging (FOWLP), chiplet integration, and advanced underfill through software-driven process control.
- Guide the digital transformation of equipment integrating MES/SECS-GEM, traceability, and predictive maintenance capabilities.
5. Innovation, Quality & Compliance
- Drive continuous improvement in software lifecycle, validation, and risk control and SEMI standards.
- Establish robust testing frameworks, regression validation, and field-upgrade systems to ensure uptime and process reliability.
- Promote a culture of innovation and intellectual property generation through advanced algorithms, control logic, and UI/UX innovations.
Job Requirements:
- At least 10 years of software engineering experience in semiconductor equipment, advanced packaging, or high-precision automation, with at least 5 years in a leadership role.
- Proven track record in real-time control, motion systems, or precision robotics for wafer-level or die-level processes.
Job Type: Full-time
Pay: RM8,000.00 - RM12,000.00 per month
Benefits:
- Dental insurance
- Free parking
- Health insurance
- Opportunities for promotion
- Vision insurance
Application Question(s):
- Are you familiar with C#, C++, .NET/WPF, and Python?
Education:
Experience:
- software engineering: 8 years (Required)
Work Location: In person
