Enflame
Enflame supplies high-performance deep learning chips and integrated computing systems for cloud AI training. It designs programmable AI accelerators with a proprietary architecture optimized for…
Enflame
Enflame supplies high-performance deep learning chips and integrated computing systems for cloud AI training. It designs programmable AI accelerators with a proprietary architecture optimized for…
Join the Team
该职位来源于猎聘 职位职责：
负责燧原AI服务器芯片的Multi-Die/Chiplet 系统需求拆解、架构规划和设计，制定D2D(Die to Die) 互联架构方案 2.
定义下一代云端AI芯片的Multi-Die/Chiplet 系统架构，拉通计算Core、NoC、Memory、SoC和Package架构团队合作，专注于提高并行计算下Multi-Die/Chip的关键性能包括时延、带宽、互联效率、功耗等 3.
分析关键应用负载（AI 大模型、多模态、搜广推等），构建仿真模型以预测未来D2D架构演进的性能和可靠性
职位要求： 1.
EE/CS硕士或更高学位，具有计算机体系结构专业知识 2.
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