Eridu

Eridu AI provides semiconductor hardware that speeds up training for large artificial intelligence models. It achieves this through silicon and optics-based solutions designed to accelerate compute…

eridu.ai

Eridu

eridu.ai

HQSaratoga, US

Team Size67

Open Jobs41

Total Funding-

Latest FundraiseUnknown

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Advanced Packaging Engineer

On-SiteSaratoga, CA, US

On-Site • Saratoga, CA, US

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About Eridu Eridu is a Silicon Valley-based hardware startup pioneering infrastructure solutions that accelerate AI data centers to deliver Faster AI . Today’s AI performance is frequently limited by communication bottlenecks. Eridu introduces multiple industry-first innovations across silicon, packaging, software, and systems to deliver an order of magnitude improvement in performance and unlock greater GPU utilization to speed training job completion times and tokens-per-second for more profitable inference. We do this while simultaneously reducing capital and power costs and improving reliability.

The company’s solutions and value proposition have been widely validated by leading hyperscalers.

Eridu has raised over $200M to date including its most recent, oversubscribed Series A round. The company is led by a veteran team of Silicon Valley executives who have delivered multiple billion dollar product lines and led multiple companies to billion dollar exits, including serial entrepreneur Drew Perkins, co-founder of Infinera (NASDAQ: INFN), Lightera (acq. by Ciena), Gainspeed (acq. by Nokia) and Mojo Vision (the world’s leading micro-LED company). The company is in execution mode and has a world-class engineering team with decades of experience in state-of-the-art silicon, packaging, optics, software, and systems. Eridu is working with best-in-class supply chain partners including silicon, packaging and systems.

Visit our website eridu.ai to learn more.

Position Overview We are seeking a highly experienced Advanced Package Engineer to lead system module packaging and advanced single chip Flip Chip IC integration for next-generation high-performance networking and compute platforms.

This role owns the end-to-end productization of composite system modules assembly, driving manufacturing readiness and product implementation consisting of organic interposers, organic substrates, cooling solutions, boards, and mechanical hardware. You will architect and deliver complete module packaging assembly solutions. This role also owns leading flip-chip single-die Flip Chip packages and advanced 2.5D integration.

You will operate as the technical owner of system module packaging, working hands-on with contract manufacturers, substrate vendors, OSATs, foundry partners, and internal silicon/system teams to translate ambitious architectures into high-volume, production-ready products.

This is a highly visible technical leadership role for an engineer who thrives at the intersection of system architecture, packaging design, mechanical modeling, manufacturing, and qualification.

Responsibilities System Module Packaging & Manufacturing Lead Own The Full Lifecycle Of System Module Packaging Assembly Integration From Architecture Through Volume Production Consisting Of Organic Interposers, Organic Substrates, Cooling Solutions, Boards, And Mechanical Hardware

Organic Substrate and Board Manufacturing Technical Lead Act as technical owner for organic substrate readiness and embedded component integration:

Drive implementation of embedded component technologies.
Own substrate BOM development and engineering builds.
Define coplanarity plans and acceptance criteria.
Coordinate substrate and board electrical and mechanical design and signoff.
Lead manufacturing, tooling cycle time optimization, yield learning, and qualification strategies.
Monitor product impedance and drive failure analysis on electrical excursions.
Monitor prototype and production yields.
Lead design rule alignment, cost tradeoffs, material selection, electrical and mechanical simulations, and reliability assessments.

Advanced Packaging Architecture Lead Provide Technical Leadership Across Emerging Packaging Domains

Qualifications

What Makes This Role Unique

Direct ownership of real system products entering manufacturing — not just concept designs.
Technical leadership across substrates → SMT → system modules → advanced IC packaging.
Opportunity to architect next-generation system module platforms.
High visibility across silicon, system, and manufacturing organizations.
Deep engagement with leading global manufacturing partners.
A chance to solve packaging challenges at true system scale.

Why Join Us? At Eridu, you’ll have the opportunity to shape the future of AI infrastructure, working with a world-class team on groundbreaking technology that pushes the boundaries of AI performance. Your contributions will directly impact the next generation of AI infrastructure solutions, transforming the performance of AI data centers.

The starting base salary for the selected candidate will be established based on their relevant skills, experience, qualifications, work location, market trends, and the compensation of employees in comparable roles.

Notice to Recruiting Agencies Eridu does not accept unsolicited resumes or candidate profiles from staffing agencies or third-party recruiters. Any candidate submitted to Eridu without prior written authorization from our recruiting team will be considered unsolicited and will become the property of Eridu. Eridu reserves the right to pursue and hire such candidates without any obligation to pay fees. Recruiting agencies are expressly instructed not to contact hiring managers, employees, or executives regarding open positions.

The Pay Range For This Role Is 210,000 - 260,000 USD per year(San Francisco Bay Area)

Lead module manufacturing and integration with contract manufacturers and internal engineering teams.

Own system module packaging qualification using Mechanical Test Vehicles (MTVs).

Drive module construction architectures, BOMs, and design approvals.

Drive mechanical modeling activities including warpage, stress, and coplanarity.

Plan and execute module builds, assembly setup, yield learning, and yield data collection.

Lead module qualification, failure analysis, root cause identification, and corrective action closure.

Drive PCB SMT assembly DOE, yield tracking, and continuous improvement initiatives.

Evaluate PCB SMT rework processes using real sample parts and production data.

Define and validate organic substrate rework strategies.

Propose and sign off daisy-chain layouts for organic substrates.

Own regular technical engagement cadence with manufacturing partners.

Establish SMT yield goals, operational metrics, and improvement roadmaps.

Productize module assembly with system integration partners.

Lead module manufacturing readiness reviews and execution.

Drive SMT soldering technology innovation through test vehicles.

Perform manufacturing risk mitigation, and schedule alignment.

Design and support module-level warpage experiments and mitigation strategies.

Lead flip-chip package development:

Coordinate electrical and mechanical modeling of high-power, high-bandwidth organic single chip flip chip packages

Drive assembly integration with OSAT partners

Coordinate substrate layout design

Design package mechanical construction

Contribute to system architecture decisions involving:

CoWoS-class interposers

3D packaging and stacking approaches

Support CPO packaging floor planning and construction trade studies

BS, or MS, or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.

8+ years of experience in system module assembly and advanced IC packaging manufacturing.

Hands-on experience with:

Organic substrates and boards (design, assembly, qualification, production)

SMT assembly, yield management, and rework

Single Chip Flip-chip packaging construction, and materials

Understanding mechanical modeling impacts (warpage, coplanarity, stress. thermal) on construction, materials, and design

Proven track record leading system module packaging assembly with contract manufacturing partners, OSATs, and foundry engagements, which includes as a module, organic interposers, organic substrates, cooling configuration, boards, and mechanical hardware.

Good understanding of high-speed / high-power package constraints.

Experience driving Mechanical Test Vehicles (MTVs), DOE, yield learning builds, and qualification programs.

Demonstrated ability to independently own complex cross-functional deliverables from architecture through prototyping and production.

Experience with system-level module packaging including cooling interfaces, boards, substrates, and mechanical hardware.

Working knowledge of advanced Flip Chip packaging architectures including:

2.5D integration and CoWoS-class interposers

3D packaging and stacked die approaches

Experience with embedded passive component technologies such as capacitors.

Failure analysis leadership across electrical and mechanical domains.

Expertise in System module packaging and single chip packaging qualifications and testing.

Background in high-performance AI accelerators, or networking hardware.

Comfortable operating in fast-moving, dynamic environments with large technical scope.