Zibo Xincai
Zibo Xincai makes high-end substrates used in advanced semiconductor packaging, supplying components for CPUs, GPUs, AI processors, and mobile electronics. The company researches, manufactures, and sells high-precision integrated circuit substrates (manufacturing and sales business model) from a large production facility founded in 2021. Its product portfolio includes FC-CSP and FC-BGA substrates and module/SIP substrates, using technologies such as 12µm fine lines, X‑Via via hole filling, high-precision laser micro-hole processing, and ultra-high multi-layer graphics alignment. Zibo Xincai operates as a B2B manufacturing company serving semiconductor and consumer electronics OEMs and integrates extensive production and testing equipment to support volume supply. The company targets advanced packaging segments across computing, AI, and mobile markets.
Zibo Xincai
Zibo Xincai makes high-end substrates used in advanced semiconductor packaging, supplying components for CPUs, GPUs, AI processors, and mobile electronics. The company researches, manufactures, and sells high-precision integrated circuit substrates (manufacturing and sales business model) from a large production facility founded in 2021. Its product portfolio includes FC-CSP and FC-BGA substrates and module/SIP substrates, using technologies such as 12µm fine lines, X‑Via via hole filling, high-precision laser micro-hole processing, and ultra-high multi-layer graphics alignment. Zibo Xincai operates as a B2B manufacturing company serving semiconductor and consumer electronics OEMs and integrates extensive production and testing equipment to support volume supply. The company targets advanced packaging segments across computing, AI, and mobile markets.