Tsingmicro
Qingwei Intelligent Technology makes low-power reconfigurable AI chips that bring efficient voice and vision processing to consumer electronics. The company designs Coarse-Grained Reconfigurable Architecture (CGRA) based SoCs and software stacks that adapt hardware resources to different algorithms for energy-optimized edge computing. Product examples include the TX210 voice AI SoC and the TX510 multimodal (voice+vision) intelligent computing chip, supporting deployments from edge devices to cloud-extended solutions. Qingwei combines chip design, firmware, algorithms and system-level software to serve device makers and OEMs in consumer electronics and IoT markets. Its technology targets energy-constrained applications that require on-device intelligence and multimodal processing.
Tsingmicro
Qingwei Intelligent Technology makes low-power reconfigurable AI chips that bring efficient voice and vision processing to consumer electronics. The company designs Coarse-Grained Reconfigurable Architecture (CGRA) based SoCs and software stacks that adapt hardware resources to different algorithms for energy-optimized edge computing. Product examples include the TX210 voice AI SoC and the TX510 multimodal (voice+vision) intelligent computing chip, supporting deployments from edge devices to cloud-extended solutions. Qingwei combines chip design, firmware, algorithms and system-level software to serve device makers and OEMs in consumer electronics and IoT markets. Its technology targets energy-constrained applications that require on-device intelligence and multimodal processing.