Tignis
Tignis offers a data analytics solution for the semiconductor industry, combining physics with AI and ML to provide automation and process control. It enables exploration of equipment operations in unobserved modes, prediction of future states, and optimization of processes. The Tignis solution utilizes physics-driven AI models and machine learning to analyze data from connected systems, offering actionable recommendations. It is targeted at semiconductor equipment manufacturers, wafer fabs, and component/material suppliers, aiming to improve reliability and efficiency through advanced analytics.
Tignis
Tignis offers a data analytics solution for the semiconductor industry, combining physics with AI and ML to provide automation and process control. It enables exploration of equipment operations in unobserved modes, prediction of future states, and optimization of processes. The Tignis solution utilizes physics-driven AI models and machine learning to analyze data from connected systems, offering actionable recommendations. It is targeted at semiconductor equipment manufacturers, wafer fabs, and component/material suppliers, aiming to improve reliability and efficiency through advanced analytics.
TL;DR
Sector: Semiconductor process control and analytics (physics + AI/ML)
Headquarters: Seattle, Washington, United States
Stage / Exit: Series A; acquired by Cohu (announced Dec 16, 2024; completed Jan 7, 2025)
Employees (reported): 11-50 (also reported 26)
Total funding (reported): USD 15,660,000
Company Overview
Problem Domain
Semiconductor process control, automation, equipment reliability, and process optimization.
Industry
Semiconductor software / industrial AI
Funding Track Record
Series A listed as May 2022; reported lead investor DN Capital; other investors include Clear Ventures, Paul Maritz, Harel Kodesh.