Skytech
Skytech makes advanced semiconductor manufacturing equipment that enables deposition and bonding steps for chip production. The company designs and manufactures PVD (Physical Vapor Deposition), ALD (Atomic Layer Deposition), wafer bonding and de-bonding systems, and related etching and polishing tools, serving front-end, back-end, compound semiconductor and optoelectronic processes. Skytech is a B2B equipment vendor that develops its own product line (e.g., Nexda PVD and Atomila ALD), and supports use cases across advanced packaging, power and automotive electronics, and third-generation semiconductors. Core technologies include PVD, PEALD, powder ALD, bonder/de-bonder, single-wafer load locks, descum and plasma polish. The company has scaled production since 2017 and reached a milestone of delivering 100 machines by Q2 2024, targeting semiconductor manufacturers and advanced fabs.
Skytech
Skytech makes advanced semiconductor manufacturing equipment that enables deposition and bonding steps for chip production. The company designs and manufactures PVD (Physical Vapor Deposition), ALD (Atomic Layer Deposition), wafer bonding and de-bonding systems, and related etching and polishing tools, serving front-end, back-end, compound semiconductor and optoelectronic processes. Skytech is a B2B equipment vendor that develops its own product line (e.g., Nexda PVD and Atomila ALD), and supports use cases across advanced packaging, power and automotive electronics, and third-generation semiconductors. Core technologies include PVD, PEALD, powder ALD, bonder/de-bonder, single-wafer load locks, descum and plasma polish. The company has scaled production since 2017 and reached a milestone of delivering 100 machines by Q2 2024, targeting semiconductor manufacturers and advanced fabs.