OpenLight
OpenLight makes it easier for engineers and companies to build high-performance photonic chips by providing a modular silicon photonics platform and related services. The company designs and manufactures Photonic Application-Specific Integrated Circuits (PASICs) that integrate active and passive components—lasers, modulators, amplifiers, and detectors—on a single silicon photonics die, and it supplies a Process Design Kit (PDK), in-house design/build services, and production via licensed foundry partners. OpenLight operates an open foundry/licensing model and offers PASIC design enablement tools (PDK), manufacturing services, and SaaS-like design workflows for semiconductor and photonics design teams. Its technology targets datacom, telecom, LiDAR, healthcare, HPC, AI, and optical computing markets where low-power, high-speed photonic integration is required.
OpenLight
OpenLight makes it easier for engineers and companies to build high-performance photonic chips by providing a modular silicon photonics platform and related services. The company designs and manufactures Photonic Application-Specific Integrated Circuits (PASICs) that integrate active and passive components—lasers, modulators, amplifiers, and detectors—on a single silicon photonics die, and it supplies a Process Design Kit (PDK), in-house design/build services, and production via licensed foundry partners. OpenLight operates an open foundry/licensing model and offers PASIC design enablement tools (PDK), manufacturing services, and SaaS-like design workflows for semiconductor and photonics design teams. Its technology targets datacom, telecom, LiDAR, healthcare, HPC, AI, and optical computing markets where low-power, high-speed photonic integration is required.
TL;DR
What they do: Modular silicon photonics platform for custom Photonic Application-Specific Integrated Circuits (PASICs)
Founded: 2022
Headquarters: Goleta / Santa Barbara area, California
Latest disclosed round: $34M Series A (Aug 26, 2025)
Key markets: Datacom, telecom, AI/datacenter, LiDAR, healthcare, HPC, sensing, optical computing
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Company Overview
Problem Domain
Scaling heterogeneous integration of active and passive photonic components for low‑power, high‑speed optical systems in datacom, telecom, AI/datacenter, sensing and HPC.
Founded
2022
Industry
Semiconductor Manufacturing
Funding Track Record
$34,000,000
Round reported as oversubscribed; other participants include Mayfield, Juniper Networks/Hewlett Packard Enterprise, Lam Capital, New Legacy Ventures, and K2 Access.
Seed funding recorded (Crunchbase) with investor participation including Jeff Crusey.
Seed funding recorded (Crunchbase).
Investor Signal
“Backed by strategic investors and industry VCs including Xora Innovation, Capricorn Investment Group, Mayfield, Juniper Networks/HPE, Lam Capital, New Legacy Ventures, K2 Access, and individual investor Jeff Crusey.”