
NEO Semiconductor is a high-tech company founded in 2012 by Andy Hsu and a team in San Jose, California, specializing in advanced 3D NAND flash memory, 3D DRAM, and 3D AI Chip technologies. The company has developed groundbreaking innovations such as X-NAND™, the world's fastest 3D NAND architecture achieving SLC speed with TLC/QLC densities, and 3D X-DRAM™, the world's first 3D NAND-like DRAM. Their 3D X-AI™ technology aims to revolutionize AI chip performance and power consumption, offering 100X acceleration and 99% power reduction. NEO Semiconductor holds over 20 U.S. patents in memory design and has received multiple 'Best of Show' awards at the Flash Memory Summit for its innovations. The company focuses on providing high-speed, low-cost solutions for AI, 5G, and various other applications.

NEO Semiconductor is a high-tech company founded in 2012 by Andy Hsu and a team in San Jose, California, specializing in advanced 3D NAND flash memory, 3D DRAM, and 3D AI Chip technologies. The company has developed groundbreaking innovations such as X-NAND™, the world's fastest 3D NAND architecture achieving SLC speed with TLC/QLC densities, and 3D X-DRAM™, the world's first 3D NAND-like DRAM. Their 3D X-AI™ technology aims to revolutionize AI chip performance and power consumption, offering 100X acceleration and 99% power reduction. NEO Semiconductor holds over 20 U.S. patents in memory design and has received multiple 'Best of Show' awards at the Flash Memory Summit for its innovations. The company focuses on providing high-speed, low-cost solutions for AI, 5G, and various other applications.