Multibeam Corporation
Multibeam offers a production-grade, maskless lithography platform that enables cost-effective, rapid time-to-market patterning for advanced semiconductor and photonics applications. The company deploys a multi-column electron-beam system of miniature e-beam columns and a digital writing system to deliver full-wafer, high-throughput nanoscale patterning with fine resolution and large depth of focus. Multibeam is a B2B hardware and software provider combining product sales with SaaS-like process and patterning software, and it integrates with industry EDA tools such as Synopsys CATS for fab workflows. Target customers include semiconductor manufacturers, foundries, advanced packaging and photonics firms, and high-mix prototyping operations. The platform is positioned to support chiplet integration, MEMS, power devices, and AI-related semiconductor applications.
Multibeam Corporation
Multibeam offers a production-grade, maskless lithography platform that enables cost-effective, rapid time-to-market patterning for advanced semiconductor and photonics applications. The company deploys a multi-column electron-beam system of miniature e-beam columns and a digital writing system to deliver full-wafer, high-throughput nanoscale patterning with fine resolution and large depth of focus. Multibeam is a B2B hardware and software provider combining product sales with SaaS-like process and patterning software, and it integrates with industry EDA tools such as Synopsys CATS for fab workflows. Target customers include semiconductor manufacturers, foundries, advanced packaging and photonics firms, and high-mix prototyping operations. The platform is positioned to support chiplet integration, MEMS, power devices, and AI-related semiconductor applications.
TL;DR
Founded: 2010 by Dr. David K. Lam
Headquarters: Santa Clara / Sunnyvale, California
Product: Multicolumn electron‑beam lithography (MEBL) platform for maskless, direct‑write full‑wafer patterning (hardware + software + services)
Applications: Advanced packaging/chiplets, silicon photonics, MEMS & sensors, rapid prototyping, on‑chip security (Secure Chip ID)
$31M Series B announced 2025-07-29 (led by Onto Innovation and Lam Capital)
