
Lotus Microsystems makes highly integrated power modules that shrink power supply size while improving thermal performance for electronics manufacturers. The company is a fabless semiconductor firm using its proprietary Lotus Power Interposer based on silicon interposers, thick-copper redistribution layers (RDL), high-aspect-ratio through-silicon vias (TSVs), precision silicon etching, and integrated passive devices to deliver up to 60% better thermal performance and much higher power density. Lotus integrates GaN, CMOS, and MEMS components and offers product lines such as the LTG thermal jumper family and the LMU20P1 miniaturized step-up supply, with additional products in development. The company targets customers in high-performance computing, AI, telecom, networking, and consumer electronics from its Copenhagen HQ and Cairo subsidiary.

Lotus Microsystems makes highly integrated power modules that shrink power supply size while improving thermal performance for electronics manufacturers. The company is a fabless semiconductor firm using its proprietary Lotus Power Interposer based on silicon interposers, thick-copper redistribution layers (RDL), high-aspect-ratio through-silicon vias (TSVs), precision silicon etching, and integrated passive devices to deliver up to 60% better thermal performance and much higher power density. Lotus integrates GaN, CMOS, and MEMS components and offers product lines such as the LTG thermal jumper family and the LMU20P1 miniaturized step-up supply, with additional products in development. The company targets customers in high-performance computing, AI, telecom, networking, and consumer electronics from its Copenhagen HQ and Cairo subsidiary.
Founded: 2020
HQ: Copenhagen (Hvidovre), Denmark
Product focus: Highly integrated power modules and thermal management for compact high-performance electronics
Tech: Silicon interposers, thick-copper RDL, high-aspect-ratio TSVs, integrated passives; integrates GaN, CMOS, MEMS
Recent funding: DKK 60M seed (Dec 2023) — NOON Ventures, European Innovation Council
Employees: 36
Miniaturized power delivery and thermal management for next-generation computing and compact electronic systems.
2020
Semiconductor Manufacturing
DKK 60,000,000
European Innovation Council participated in the round; announced alongside CEO appointment.
“Institutional backing from NOON Ventures and the European Innovation Council”
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