
Extreme-bandwidth data transmission enabled by light
Headquarters: Lausanne / Renens, Switzerland
Team size: 6 employees
Tech focus: Chip-scale comb/microcomb lasers and silicon-nitride photonics for extreme-bandwidth optical interconnects
Target market: AI infrastructure, data centers, photonic accelerators
Total funding: USD 4,000,000 (as of 2023-05-09)
High-bandwidth, low-power data interconnects for AI infrastructure and data centers.
2021
Photonics / Optical interconnects
Latest recorded round listed as non-equity assistance