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The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated…

The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated…
Headquarters: Lausanne, Switzerland
Product: Microfluidic liquid cooling (microfluidic cold plates and co‑packaged cooling) for high‑power chips
Claimed performance: Up to 10x more heat extraction and 50x better energy efficiency vs current alternatives
Recent financing: Series A activity (reported €20M round; total disclosed funding ~€28.5M)
Thermal management of high‑performance semiconductor chips used in data centers, HPC, and AI workloads.
Computers and Electronics Manufacturing
€20M
Reported Series A round of €20M (Dealroom/Crunchbase summaries)
USD 25M
Company site states a $25M Series A1 led by Applied Digital
Reported prior seed and grant support (Venture Kick, Intel Ignite, Prix Strategis)
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