
AttoTude is a pioneering technology company revolutionizing data centers with its advanced terahertz (THz) radio over wire interconnect technology. Their flagship products, AttoEngine and AttoWire, deliver unprecedented data communication speeds up to 448 Gb/s, addressing critical networking challenges in speed, distance, power, reliability, and cost. This innovation is designed to overcome the scaling bottlenecks in AI and hyperscale data centers, enabling high-speed parallel processing and supercomputing applications. Backed by leading venture capital firms and led by industry veterans with deep expertise in optical communications and RF electronics, AttoTude is positioned as a transformative player in the data center interconnect market, driving the future of AI and Exascale technology with scalable, energy-efficient, and high-performance networking solutions.

AttoTude is a pioneering technology company revolutionizing data centers with its advanced terahertz (THz) radio over wire interconnect technology. Their flagship products, AttoEngine and AttoWire, deliver unprecedented data communication speeds up to 448 Gb/s, addressing critical networking challenges in speed, distance, power, reliability, and cost. This innovation is designed to overcome the scaling bottlenecks in AI and hyperscale data centers, enabling high-speed parallel processing and supercomputing applications. Backed by leading venture capital firms and led by industry veterans with deep expertise in optical communications and RF electronics, AttoTude is positioned as a transformative player in the data center interconnect market, driving the future of AI and Exascale technology with scalable, energy-efficient, and high-performance networking solutions.
Product: THz-over-wire interconnect platform (AttoEngine, AttoWire) for AI and hyperscale data centers
Founders: Dave (David F.) Welch (Founder & CEO) and Joy Laskar (Founder & CTO)
Headquarters: Menlo Park, California (office in Ottawa, Ontario)
Employee count: 32
Total funding: USD 91,000,000 (company-stated after Series B)
Data-center interconnects for AI and hyperscale computing
Data center networking / optical/RF communications
USD 11,000,000
Company-stated seed round amount in 2024
USD 29,000,000
Participating investors reported: Sutter Hill Ventures, Canaan Partners, Wing Venture Capital
USD 50,000,000
Reported lead investor and participating VCs
“Backed by venture investors including Mayfield Fund, The Westly Group, Sutter Hill Ventures, Canaan Partners, and Wing Venture Capital”