Company Description
Absolics Inc. is the world’s first glass substrate manufacturer and a leader in advanced packaging technologies. The company provides scalable solutions tailored for businesses in high-performance computing. Absolics pioneers innovative manufacturing techniques to support cutting-edge semiconductor advancements. Located in Covington, GA, the company is positioned at the forefront of the technology industry.
Job Title:
Process Integration Engineer
Location:
Covington, GA
Job Type:
Full-Time
Job Description:
We are seeking a Tech Integration Engineer to support glass substrate development and process integration for semiconductor packaging applications. This role focuses on process integration, technology validation, and manufacturing readiness, ensuring that both existing and newly developed processes, materials, and equipment can be successfully implemented in production.
The engineer will support sample development, process optimization, and new technology development, while collaborating with cross-functional teams including R&D, Process Engineering, Manufacturing, Quality, and the NPI team. This role will contribute to improving product performance, supporting new product introduction activities, and enabling future packaging technologies.
Key Responsibilities:
- Perform technology validation and manufacturing readiness evaluations for new processes, materials, and equipment.
- Support process integration activities for glass substrate development and engineering projects
- Design and execute DOE (Design of Experiments) and perform statistical analysis for materials, process conditions, and structural optimization
- Optimize process conditions and substrate structures to improve product performance, yield, and process stability
Qualifications:
- Bachelor’s degree or higher in Materials Science, Chemical Engineering, Mechanical Engineering, or related engineering field
- 5+ years of experience in substrate manufacturing/Development or packaging industry
- Hands-on experience supporting NPI programs and transition to high-volume manufacturing (HVM)
- Experience leading or directly managing engineering development projects or technology development tasks
- Proficiency with data analysis tools such as Excel, JMP, Minitab, or similar statistical software
Preferred Skills:
- Experience with glass substrate or advanced substrate technologies
- Experience in Semiconductor, PCB, Substrate, or OSAT industries
- Familiarity with panel-level packaging (PLP) or next-generation packaging technologies
- Fluent in English; proficiency in Korean is a plus.
