Nearfield Instruments is a scale-up bringing together creative minds in science and technology to develop revolutionary high-throughput atomic force microscopy (AFM) systems. Our technology enables atom-scale, true 3D metrology at industry-level throughput and is increasingly critical to advanced semiconductor manufacturing.
We design, develop, integrate, market, and service advanced metrology tools and are expanding our service footprint across the U.S. and Asia in support of key semiconductor customers.
What will you be doing?
As an Equipment Engineering Specialist II, you are the onsite technical program lead responsible for product performance, technology readiness, and strategic execution at a customer development site.
You act as the single point of accountability for product-line technical issues, bridging customer needs, field execution, and internal engineering. This role sits at the intersection of new product introduction (NPI), technology development, and HVM ramp readiness, requiring both hands-on technical depth and program-level leadership.
You will work closely with Technical Program Managers, Service Leadership, and Applications team to ensure alignment to customer objectives, while driving continuous improvement, risk mitigation, and technical innovation.
Key Responsibilities
Technical Ownership & Execution
- Lead technology readiness and transition from development to HVM
- Own complex tool, system, and process issue resolution in a fab environment
- Drive structured troubleshooting, root cause analysis, and corrective actions
- Define and implement equipment, software, and process improvements with engineering
Program & Customer Leadership
- Serve as primary technical interface to the customer for all product-related topics
- Build strong relationships with customer engineers, tool owners, and management
- Lead cross-functional task forces to resolve critical issues (safety, reliability, process, software)
- Deliver clear program updates, status reports, and executive-level communication
Safety, Risk & Compliance
- Perform risk assessments for all product and process changes prior to execution
- Ensure compliance with industry standards (SEMI, CE) and site safety requirements
Continuous Improvement & Strategy
- Drive continuous improvement (CIP) and innovative technical solutions
- Support technology transfer and scaling strategies for HVM ramp and site growth
Operational Alignment
- Align with service and spares teams to define sustaining support requirements
- Support installation, upgrade, and service execution to meet customer commitments
- Escalate risks proactively when performance or commitments are at risk
What do we require from you?
- Proven ability to operate as a technical authority in a customer-facing semiconductor environment
- Strong program ownership mindset with the ability to lead across functions without direct authority
- Demonstrated capability in risk assessment, problem-solving, and structured decision-making
- Ability to balance strategic thinking with hands-on execution
- Excellent communication, presentation, and stakeholder management skills
- Self-directed, high-accountability individual comfortable operating in a fast-paced, evolving environment
Specific education & experience include:
- Bachelor’s degree in Engineering (preferred); PMP or equivalent project management experience is a plus
- :10+ years of experience in semiconductor capital equipment or fab operations
- Strong technical background in:
- Equipment engineering, installation, and maintenance
- Structured troubleshooting and root cause methodologies
- Experience supporting advanced semiconductor customers in development and/or HVM environments
Working knowledge of:
- Data analysis and statistical methods & Quality methodologies (e.g., Six Sigma)
- Industry standards (SEMI, CE)
- Proficiency with standard engineering and business tools (MS Office, SAP, SharePoint, etc.)
